Imaging device

ABSTRACT

An imaging device including an imaging cell including a photoelectric converter including a first electrode, a second electrode, and a photoelectric conversion layer between the first electrode and the second electrode, and a first transistor one of a source and a drain of which is coupled to the first electrode; and voltage supply circuitry coupled to the other of the source and the drain of the first transistor, the voltage supply circuitry being configured to supply a first voltage in a first period and a second voltage different from the first voltage in a second period different from the first period.

RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.15/876,258, filed on Jan. 22, 2018, which in turn claims the benefit ofJapanese Application No. 2017-182534, filed on Sep. 22, 2017, JapaneseApplication No. 2017-019091, filed on Feb. 3, 2017, and JapaneseApplication No. 2017-019090, filed on Feb. 3, 2017, the disclosures ofwhich are incorporated in their entirety by reference herein.

BACKGROUND 1. Technical Field

The present disclosure relates to an imaging device.

2. Description of the Related Art

Image sensors utilizing photoelectric conversion are widely used. As areplacement for pinned photodiodes, a structure in which a photoelectricconversion device is arranged above a semiconductor substrate has beenproposed (see International Publication No. WO 2014/002367). Thesolid-state imaging device described in International Publication No. WO2014/002367 has a photoelectric conversion device including a lowerelectrode, an upper transparent electrode, and a photoelectricconversion film interposed between the lower electrode and the uppertransparent electrode. Signal charges, which are generated in thephotoelectric conversion device and collected by the lower electrode,are accumulated in a charge accumulation node. The signal chargesaccumulated in the charge accumulation node are read to a verticalsignal line in the form of pixel signal. The contents of the disclosureof International Publication No. WO 2014/002367 are incorporated hereinby reference in its entirety.

SUMMARY

One non-limiting and exemplary embodiment provides an imaging devicethat reduces complexity of circuits in an imaging cell and has improvedflexibility at the time of photographing.

In one general aspect, the techniques disclosed herein feature thefollowing: an imaging device including: an imaging cell including aphotoelectric converter including a first electrode, a second electrode,and a photoelectric conversion layer between the first electrode and thesecond electrode, and a first transistor one of a source and a drain ofwhich is coupled to the first electrode; and voltage supply circuitrycoupled to the other of the source and the drain of the firsttransistor, the voltage supply circuitry being configured to supply afirst voltage in a first period and a second voltage different from thefirst voltage in a second period different from the first period.

It should be noted that general or specific embodiments may beimplemented as a system, a method, an integrated circuit, a computerprogram, a storage medium, or any selective combination thereof.

Additional benefits and advantages of the disclosed embodiments willbecome apparent from the specification and drawings. The benefits and/oradvantages may be individually obtained by the various embodiments andfeatures of the specification and drawings, which need not all beprovided in order to obtain one or more of such benefits and/oradvantages.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram schematically illustrating an overview of anexemplary configuration of an imaging device according to Embodiments ofthe present disclosure;

FIG. 2 is a diagram illustrating an exemplary circuit configuration ofan imaging device according to Embodiment 1 of the present disclosure;

FIG. 3 is a diagram illustrating an instance of electrical couplingbetween a first signal line and a pixel electrode;

FIG. 4 is a diagram for explaining an instance of the operation when arolling shutter is applied to an imaging device illustrated in FIG. 2;

FIG. 5A is a diagram schematically illustrating arrangement of imagingcells with different sensitivities when a reset voltage is switchedbetween a high voltage and a low voltage row by row in a pixel array;

FIG. 5B is a diagram schematically illustrating arrangement of theimaging cells with sensitivities changed when the reset voltage isswitched between the high voltage and the low voltage for all theimaging cells included in the pixel array;

FIG. 6 is a diagram schematically illustrating an overview ofconfiguration in which a voltage written to the pixel electrode iscontrollable imaging cell by imaging cell;

FIG. 7 is a diagram illustrating an instance in which imaging cells forwhich voltages written to pixel electrodes are different are mixed in arow direction and a column direction;

FIG. 8 is a diagram illustrating an instance of a specific configurationof a selection circuit;

FIG. 9 is a diagram illustrating another example of a specificconfiguration of the selection circuit;

FIG. 10 is a schematic sectional view illustrating an exemplary devicestructure of each imaging cell;

FIG. 11 is a diagram illustrating another exemplary circuitconfiguration of the imaging device according to Embodiment 1 of thepresent disclosure;

FIG. 12 is a diagram illustrating an overview of a circuit configurationof one imaging cell taken from imaging cells in the pixel array;

FIG. 13 is a diagram illustrating another example of a circuitconfiguration of the imaging device including the imaging cell having afeedback circuit;

FIG. 14 is a diagram illustrating an exemplary circuit configuration ofan imaging cell of an imaging device according to Embodiment 2 of thepresent disclosure;

FIG. 15 is a diagram illustrating an exemplary circuit configuration ofan imaging device according to Embodiment 3 of the present disclosure;

FIG. 16 is a diagram illustrating an overview of a circuit configurationof one imaging cell taken from imaging cells in the pixel array;

FIG. 17 is a diagram illustrating a variation of the circuitconfiguration of the imaging cell;

FIG. 18 is a diagram illustrating an exemplary circuit configuration ofan imaging cell of an imaging device according to Embodiment 4 of thepresent disclosure;

FIG. 19 is a diagram for explaining an instance of the operation of theimaging device to which an imaging cell illustrated in FIG. 18 isapplied;

FIG. 20 is a diagram illustrating an exemplary circuit configuration ofa pixel array of an imaging device according to Embodiment 5 of thepresent disclosure;

FIG. 21 is a diagram illustrating an exemplary circuit configuration ofa pixel array of an imaging device according to Embodiment 6 of thepresent disclosure;

FIG. 22 is a diagram illustrating a variation of the pixel array of theimaging device according to Embodiment 6 of the present disclosure;

FIG. 23 is a diagram for explaining an instance of the operation of theimaging device to which imaging cells illustrated in FIG. 21 areapplied;

FIG. 24 is a functional block diagram of an exemplary imaging modulehaving an imaging device according to an Embodiment of the presentdisclosure;

FIG. 25 is a schematic sectional view illustrating an instance of aphotoelectric converter;

FIG. 26 is a diagram illustrating an instance of a material applicableto a photoelectric conversion layer;

FIG. 27 is a schematic sectional view illustrating another example ofthe photoelectric converter;

FIG. 28 is an energy diagram in still another configuration example ofthe photoelectric converter;

FIG. 29 is a diagram illustrating the chemical formula of CZBDF;

FIG. 30 is a diagram illustrating an instance of an absorption spectrumin a photoelectric conversion layer including tin naphthalocyanine;

FIG. 31 is graph illustrating the voltage dependence of external quantumefficiency in a sample of Example 1-1;

FIG. 32 is a graph illustrating the relationship between externalquantum efficiency and applied electric field with wavelengths of 460nm, 540 nm, 680 nm, and 880 nm for the sample of Example 1-1;

FIG. 33 is a graph illustrating the voltage dependence of externalquantum efficiency in a sample of Reference Example 1;

FIG. 34 is a graph illustrating the voltage dependence of externalquantum efficiency in a sample of Example 1-2;

FIG. 35 is a graph illustrating the voltage dependence of externalquantum efficiency in a sample of Comparative Example 1;

FIG. 36 is a graph illustrating the voltage dependence of externalquantum efficiency in a sample of Example 2-1;

FIG. 37 is a graph illustrating the voltage dependence of externalquantum efficiency in a sample of Comparative Example 2-1;

FIG. 38 is an energy diagram for a sample of Example 2-2;

FIG. 39 is a graph illustrating the voltage dependence of externalquantum efficiency in a sample of Example 2-2;

FIG. 40 is an energy diagram for a sample of Comparative Example 2-2;

FIG. 41 is a graph illustrating the voltage dependence of externalquantum efficiency in a sample of Comparative Example 2-2; and

FIG. 42 is a graph illustrating a typical photocurrent characteristic ofa photoelectric conversion structure according to Embodiments of thepresent disclosure.

DETAILED DESCRIPTION

(Underlying Knowledge of Inventors)

The solid-state imaging device described in International PublicationNo. WO 2014/002367 applies a positive bias voltage to the uppertransparent electrode at the time of operation. Thus, a positive hole,which is one of an electron and a positive hole generated in thephotoelectric conversion film upon receiving incident light, iscollected by the lower electrode and utilized as a signal charge. Theinventors have focused attention on the phenomenon that the chargesgenerated by photoelectric conversion are moved in the photoelectricconversion film by an electric field according to a difference ofpotential applied across the electrodes by which the photoelectricconversion film is interposed. The inventors have found out thatefficiency (in other words, sensitivity) of collection of signal chargescan be changed according to a bias voltage applied to the uppertransparent electrode.

In the solid-state imaging device described in International PublicationNo. WO 2014/002367, for instance, as illustrated in FIG. 3A, the uppertransparent electrode, to which the bias voltage is applied, is providedon the photoelectric conversion film in common with multiple unit pixelcells included in the pixel section of the solid-state imaging device.That is, the bias voltage applied to the upper transparent electrode ofeach unit pixel cell is in common. Therefore, when the bias voltageapplied to the upper transparent electrode is changed, the sensitivityof all unit pixel cells is changed according to the bias voltage, and itis not possible to selectively change the sensitivity of part of theunit pixel cells. For instance, it is not possible to selectively makethe sensitivity of the unit pixel cells located in one row of the arrayof unit pixel cells higher or lower than the sensitivity of the unitpixel cells located in another row.

In the field of imaging devices, for photographing a scene with a largedynamic range, there is demand for selective change of the sensitivityof part of the unit pixel cells. For instance, when a scene including asubject which emits intense light is simply photographed, blown outhighlights occur in a photographed image. Although blown out highlightscan be suppressed by reducing the sensitivity of the unit pixel cells,overall brightness of the image is decreased, and blocked up shadows mayoccur in the image. A technique called “high dynamic range imaging” isknown, in which a scene is photographed with varied sensitivities, andmultiple images obtained with different sensitivities are rendered,thereby forming an image without blown out highlights and blocked upshadows. However, in such a technique in related art, the timing ofphotographing multiple images obtained with different sensitivities isoff. Therefore, the technique may be unsuitable for photographing ascene including an object moving at a high speed, for instance.

It is useful when multiple image signals according to differentsensitivities are obtained by single photographing. In particular, it isuseful when the sensitivity of part of the cells can be selectivelychanged. For instance, it is useful when the sensitivity of imagingcells can be changed row by row in multiple imaging cells, or imagingcell by imaging cell. The inventors have discussed in consideration ofthe aforementioned points, and have made the disclosure of the presentapplication.

Summary of Embodiments

Before Embodiments of the present disclosure is described, a summary ofthe Embodiments of the present disclosure will be described. The summaryin an aspect of the present disclosure is as follows.

[Item 1]

An imaging device including:

an imaging cell including

-   -   a photoelectric converter including a first electrode, a second        electrode, and a photoelectric conversion layer between the        first electrode and the second electrode, the photoelectric        converter generating signal charge by photoelectric conversion,        and    -   a charge detection circuit connected to the first electrode, the        charge detection circuit detecting the signal charge;

a signal line electrically coupled to the first electrode; and

a voltage supply circuit selectively supplying a first voltage and asecond voltage different from the first voltage to the signal line.

[Item 2]

The imaging device according to Item 1, wherein the charge detectioncircuit includes a first transistor having a source and a drain, one ofthe source and the drain of the first transistor being connected to thefirst electrode, the other of the source and the drain of the firsttransistor being connected to the signal line.

[Item 3]

The imaging device according to Item 2, further including a selectioncircuit connected to a first control line and a second control line, theselection circuit switching between ON and OFF of the first transistorbased on a voltage of the first control line and a voltage of the secondcontrol line.

[Item 4]

The imaging device according to Item 1, further including an invertingamplifier having an inverting input terminal, a non-inverting inputterminal, and an output terminal, wherein

the charge detection circuit includes:

-   -   a first transistor having a source and a drain, one of the        source and the drain of the first transistor being connected to        the first electrode, the other of the source and the drain of        the first transistor being electrically connected to the output        terminal; and    -   a second transistor having a source, a drain and a gate, the        gate of the second transistor being connected to the first        electrode, one of the source and the drain of the second        transistor being electrically connected to the inverting input        terminal, and

the signal line is connected to the non-inverting input terminal.

[Item 5]

The imaging device according to Item 1, wherein the charge detectioncircuit includes a first capacitor having one terminal connected to thefirst electrode, and the other terminal connected to the signal line.

[Item 6]

The imaging device according to Item 5, wherein the voltage supplycircuit supplies the first voltage to the signal line in a reset periodin a first frame period, and supplies the second voltage to the signalline in a charge accumulation period in the first frame period.

[Item 7]

The imaging device according to any one of Items 2 to 4, wherein thevoltage supply circuit supplies the first voltage to the signal line ina reset period in a first frame period, and supplies the second voltageto the signal line in a reset period in a second frame period differentfrom the first frame period.

[Item 8]

The imaging device according to Item 5, wherein the voltage supplycircuit supplies the first voltage to the signal line in a chargeaccumulation period in a first frame period, and supplies the secondvoltage to the signal line in a charge accumulation period in a secondframe period different from the first frame period.

[Item 9]

The imaging device according to any one of Items 1 to 8, wherein

the photoelectric conversion layer includes a first layer and a secondlayer stacked one on the other,

the first layer includes a first material,

the second layer includes a second material, and

impedance of the first layer is greater than impedance of the secondlayer.

[Item 10]

The imaging device according to any one of Items 1 to 8, wherein

the photoelectric conversion layer includes a first layer and a secondlayer stacked one on the other,

the first layer includes a first material,

the second layer includes a second material, and

an ionization potential of the first material is greater than anionization potential of the second material by 0.2 eV or more.

[Item 11]

The imaging device according to Item 9 or 10, wherein the first materialand the second material are both electron-donating molecules.

[Item 12]

An imaging device having one or more imaging cells,

the imaging device including:

a semiconductor substrate; and

a first voltage supply circuit to which a first signal line isconnected, wherein

each of the one or more imaging cells has

a photoelectric converter supported by the semiconductor substrate, thephotoelectric converter including a first electrode, a second electrodedisposed more distantly from the semiconductor substrate than the firstelectrode, and a photoelectric conversion structure inserted between thefirst electrode and the second electrode, and

a charge detector including a first transistor connected to the firstelectrode,

the first electrode of the photoelectric converter is electricallycoupled to the first signal line, and

the first voltage supply circuit applies at least a first voltage and asecond voltage different from the first voltage in absolute value to thefirst signal line at different timings.

With the configuration of Item 12, the voltage applied to the firstsignal line can be switched, and the sensitivity of the imaging cellsmay be changed by switching the voltage applied to the first signalline.

[Item 13]

The imaging device according to Item 12, wherein the first electrode isconnected to the gate of the first transistor of the charge detector.

With the configuration of Item 13, non-destructive read of a signalcharge is possible.

[Item 14]

The imaging device according to Item 13, wherein the charge detectorincludes a reset circuit having a second transistor having one of thesource and the drain connected to the first electrode.

[Item 15]

The imaging device according to Item 14, wherein the other of the sourceand the drain of the second transistor is connected to the first signalline.

With the configuration of Item 15, it is possible to reset the potentialof the charge storage node to a predetermined voltage level by using thevoltage applied to the first signal line from the first voltage supplycircuit.

[Item 16]

The imaging device according to Item 15, wherein

the one or more imaging cells include multiple imaging cells,

the multiple imaging cells are disposed two-dimensionally in a firstdirection and a second direction different from the first direction,

the imaging devices further include multiple second signal linesextending in the first direction, and multiple third signal linesextending in the second direction,

each imaging cell has

a selection circuit that switches between ON and OFF of the secondtransistor according to a voltage level of corresponding one of multiplesecond signal lines and a voltage level of corresponding one of multiplethird signal lines.

With the configuration of Item 16, it is possible to select an imagingcell at any position in the pixel array, and change the potential of thefirst electrode of the selected imaging cell.

[Item 17]

The imaging device according to Item 14, wherein

the reset circuit includes a feedback circuit that causes negativefeedback of an electrical signal generated in the photoelectricconverter,

the feedback circuit includes an inverting amplifier having an invertinginput terminal electrically connected to one of the source and the drainof the first transistor and an output terminal electrically connected tothe other of the source and the drain of the second transistor, and

a non-inverting input terminal of the inverting amplifier is connectedto the first signal line.

With the configuration of Item 17, it is possible to reset the potentialof the charge storage node to a predetermined voltage level by using thevoltage applied to the first signal line from the first voltage supplycircuit, and the effect of random noise can be cancelled utilizing thenegative feedback.

[Item 18]

The imaging device according to Item 14, wherein

the charge detector includes a capacitive circuit connected between thefirst electrode and the first signal line,

the capacitive circuit has a first capacitor, and

the first electrode of the photoelectric converter is electricallycoupled to the first signal line via the first capacitor.

With the configuration of Item 18, it is possible to change thepotential of the pixel electrode by the change in the voltage applied tothe first signal line without affecting the quantity of chargeaccumulated in the charge accumulation node. Therefore, for instance, asa voltage applied to the first signal line in the charge accumulationperiod, a voltage different from the voltage applied to the first signalline can be used in the reset period.

[Item 19]

The imaging device according to Item 18, wherein the first voltagesupply circuit applies the first voltage to the first signal line in thecharge accumulation period, and applies the second voltage to the firstsignal line in a period other than the charge accumulation period out ofthe frame period.

With the configuration of Item 19, it is possible to temporarilyincrease or decrease the potential of the first electrode in the chargeaccumulation period. The potential difference between the firstelectrode and the second electrode is reduced or enlarged at the startof the charge accumulation period, and thus the sensitivity of theimaging cells is changed by switching the voltage applied to the firstsignal line.

[Item 20]

The imaging device according to Item 18 or 19, wherein the one or moreimaging cells include a first imaging cell and a second imaging cell.

[Item 21]

The imaging device according to Item 20, wherein

the reset circuit includes a feedback circuit that causes negativefeedback of an electrical signal generated in the photoelectricconverter,

the feedback circuit includes an inverting amplifier having an invertinginput terminal electrically connected to one of the source and the drainof the first transistor, and an output terminal electrically connectedto the other of the source and the drain of the second transistor, and

the first capacitor of the first imaging cell is connected between thefirst signal line and the first electrode of the first imaging cell.

With the configuration of Item 21, the change in the potentialdifference between the first electrode and the second electrode can bemade different between the first imaging cell and the second imagingcell while the voltage applied to the first signal line is used incommon.

[Item 22]

The imaging device according to Item 21, wherein the first capacitor ofthe second imaging cell is connected between the first signal line andthe first electrode of the second imaging cell.

With the configuration of Item 22, the change in the potentialdifference between the first electrode and the second electrode can bemade different between the first imaging cell and the second imagingcell while the voltage applied to the first signal line is used incommon.

[Item 23]

The imaging device according to Item 22, wherein

the feedback circuit of the first imaging cell further includes a thirdtransistor connected between the other of the source and the drain ofthe second transistor and the output terminal of the invertingamplifier,

the capacitive circuit of the first imaging cell further includes asecond capacitor having one of the electrodes connected to the firstelectrode of the first imaging cell, and the other of the electrodesconnected to the other of the source and the drain of the secondtransistor, and

the capacitive value of the second capacitor is smaller than thecapacitive value of the first capacitor of the first imaging cell.

With the configuration of Item 23, it is possible to reduce the effectthe change in the voltage applied to the first signal line on thepotential difference between the first electrode and the secondelectrode. In addition, random noise can be reduced more effectively.

[Item 24]

The imaging device according to Item 22 or 23, wherein the capacitivevalue of the first capacitor is different between the first imaging celland the second imaging cell.

With the configuration of Item 24, the change in the potentialdifference between the first electrode and the second electrode can bemade different between the first imaging cell and the second imagingcell while the voltage applied to the first signal line is used incommon.

[Item 25]

The imaging device according to any one of Items 12 to 24, furtherincluding

a second voltage supply circuit connected to the second electrode,wherein

the second voltage supply circuit switches the voltage applied to thesecond electrode between a third voltage and a fourth voltage differentfrom the third voltage in absolute value at a timing between twodifferent charge accumulation periods.

With the configuration of Item 25, the change in the potentialdifference between the first electrode and the second electrode can bemade different between two charge accumulation periods included indifferent frames while the voltage applied to the first signal line isused in common.

[Item 26]

The imaging device according to any one of Items 20 to 25, wherein

the second electrode of the first imaging cell and the second electrodeof the second imaging cell are electrically separated,

the imaging device further includes a second voltage supply circuitconnected to the second electrode of the first imaging cell and thesecond electrode of the second imaging cell, and

the second voltage supply circuit independently applies differentvoltages to the second electrode of the first imaging cell and thesecond electrode of the second imaging cell, respectively.

With the configuration of Item 26, the bias voltage applied to thephotoelectric conversion structure in the charge accumulation period canbe made different between the first and second imaging cells.

[Item 27]

The imaging device according to Item 15, wherein

the one or more imaging cells include the first imaging cell and thesecond imaging cell, and

the first voltage supply circuit supplies the first voltage to thesecond transistor of the first imaging cell by applying the firstvoltage to the first signal line at a first timing, and supplies thesecond voltage to the second transistor of the second imaging cell byapplying the second voltage to the first signal line at a second timing.

With the configuration of Item 27, the bias voltage applied to thephotoelectric conversion structure can be made different between thefirst and second imaging cells.

[Item 28]

The imaging device according to Item 17, wherein

the one or more imaging cells include the first imaging cell and thesecond imaging cell, and

the first voltage supply circuit supplies the first voltage to theinverting amplifier of the first imaging cell by applying the firstvoltage to the first signal line at a first timing, and supplies thesecond voltage to the inverting amplifier of the second imaging cell byapplying the second voltage to the first signal line at a second timing.

With the configuration of Item 28, the bias voltage applied to thephotoelectric conversion structure can be made different between thefirst and second imaging cells.

[Item 29]

An imaging device having one or more imaging cells,

the imaging device including:

a semiconductor substrate; and

a voltage supply circuit,

in which each of the one or more imaging cells includes a first imagingcell and a second imaging cell each having:

a photoelectric converter supported by the semiconductor substrate, thephotoelectric converter including a first electrode, a second electrodedisposed more distantly from the semiconductor substrate than the firstelectrode, and a photoelectric conversion structure inserted between thefirst electrode and the second electrode, and

a charge detector including a first transistor connected to the firstelectrode,

the second electrode of the first imaging cell and the second electrodeof the second imaging cell are electrically separated,

the voltage supply circuit is connected to the second electrode of thefirst imaging cell and the second electrode of the second imaging cell,and

the voltage supply circuit independently applies different voltages tothe second electrode of the first imaging cell and the second electrodeof the second imaging cell, respectively.

With the configuration of Item 29, the bias voltage applied to thephotoelectric conversion structure can be made different between thefirst and second imaging cells.

[Item 30]

The imaging device according to any one of Items 20 to 29, wherein apotential difference applied across the first electrode and the secondelectrode of the first imaging cell at the time of start of a chargeaccumulation period is different from a potential difference appliedacross the first electrode and the second electrode of the secondimaging cell at the time of start of the charge accumulation period.

[Item 31]

The imaging device according to any one of Items 12 to 30, wherein

the photoelectric conversion structure includes a multilayer structurehaving a first photoelectric conversion layer and a second photoelectricconversion layer,

the first photoelectric conversion layer and the second photoelectricconversion layer include a first material and a second material,respectively, and

impedance of the first photoelectric conversion layer is greater thanimpedance of the second photoelectric conversion layer.

With the configuration of Item 31, the spectral sensitivitycharacteristic of the photoelectric conversion structure can be changedby changing the potential difference applied across the first electrodeand the second electrode.

[Item 32]

The imaging device according to any one of Items 12 to 30, wherein

the photoelectric conversion structure includes a multilayer structurehaving a first photoelectric conversion layer and a second photoelectricconversion layer,

the first photoelectric conversion layer and the second photoelectricconversion layer include a first material and a second material,respectively, and

the ionization potential of the first material is greater than theionization potential of the second material by 0.2 eV or more.

With the configuration of Item 32, the spectral sensitivitycharacteristic of the photoelectric conversion structure can be changedby changing the potential difference applied across the first electrodeand the second electrode.

[Item 33]

The imaging device according to Item 31 or 32, wherein the firstmaterial and the second material are electron-donating molecules.

[Item 34]

An imaging device having multiple imaging cells each including a firstimaging cell and a second imaging cell,

in which the first imaging cell has a first photoelectric converter anda first charge detector,

the second imaging cell has a second photoelectric converter and asecond charge detector,

the first photoelectric converter includes

a first electrode, a second electrode, and a first photoelectricconversion structure located between the first electrode and the secondelectrode,

the first charge detector includes

a first transistor connected to the first electrode, and a secondtransistor having one of a source and a drain connected to the firstelectrode,

the second photoelectric converter includes

a third electrode, a fourth electrode, and a second photoelectricconversion structure located between the third electrode and the fourthelectrode,

the second charge detector includes

a third transistor connected to the third electrode, and a fourthtransistor having one of a source and a drain connected to the thirdelectrode,

the imaging device further includes:

a first signal line that is connected to the other of the source and thedrain of the second transistor, and supplies a first voltage to theother of the source and the drain of the second transistor; and

a second signal line that is connected to the other of the source andthe drain of the fourth transistor, and supplies a second voltagedifferent from the first voltage in absolute value to the other of thesource and the drain of the fourth transistor.

With the configuration of Item 34, the bias voltage applied to thephotoelectric conversion structure can be made different between thefirst and second imaging cells.

[Item 35]

An imaging device having multiple imaging cells each including a firstimaging cell and a second imaging cell,

in which the first imaging cell has a first photoelectric converter anda first charge detector,

the second imaging cell has a second photoelectric converter and asecond charge detector,

the first photoelectric converter includes

a first electrode, a second electrode, and a first photoelectricconversion structure located between the first electrode and the secondelectrode,

the first charge detector includes

a first transistor connected to the first electrode, and a firstfeedback circuit that causes negative feedback of an electrical signalgenerated in the first photoelectric converter,

the second photoelectric converter includes

a third electrode, a fourth electrode, and a second photoelectricconversion structure located between the third electrode and the fourthelectrode,

the second charge detector includes

a second transistor connected to the third electrode, and a secondfeedback circuit that causes negative feedback of an electrical signalgenerated in the second photoelectric converter,

the first feedback circuit includes a first inverting amplifier havingan inverting input terminal electrically connected to one of the sourceand the drain of the first transistor,

the second feedback circuit includes a second inverting amplifier havingan inverting input terminal electrically connected to one of the sourceand the drain of the second transistor,

the imaging device further includes:

a first signal line that is connected to a non-inverting input terminalof the first inverting amplifier, and supplies a first voltage to thenon-inverting input terminal of the first inverting amplifier; and

a second signal line that is connected to a non-inverting input terminalof the second inverting amplifier, and supplies a second voltage to thenon-inverting input terminal of the second inverting amplifier.

With the configuration of Item 35, the bias voltage applied to thephotoelectric conversion structure can be made different between thefirst and second imaging cells.

[Item 36]

The imaging device according to Item 34 or 35, wherein a potentialdifference applied across the first electrode and the second electrodeat the time of start of a charge accumulation period is different from apotential difference applied across the third electrode and the fourthelectrode at the time of start of the charge accumulation period.

[Item 37]

The imaging device according to any one of Items 34 to 36, wherein

each of the first photoelectric conversion structure and the secondphotoelectric conversion structure includes at least part of amultilayer structure having a first photoelectric conversion layer and asecond photoelectric conversion layer,

the first photoelectric conversion layer and the second photoelectricconversion layer include a first material and a second material,respectively, and

impedance of the first photoelectric conversion layer is greater thanimpedance of the second photoelectric conversion layer.

With the configuration of Item 37, the spectral sensitivitycharacteristic of the photoelectric conversion structure can be changedby changing the potential difference applied across the first electrodeand the second electrode.

[Item 38]

The imaging device according to any one of Items 34 to 36, wherein

each of the first photoelectric conversion structure and the secondphotoelectric conversion structure includes at least part of amultilayer structure having a first photoelectric conversion layer and asecond photoelectric conversion layer,

the first photoelectric conversion layer and the second photoelectricconversion layer include a first material and a second material,respectively, and

the ionization potential of the first material is greater than theionization potential of the second material by 0.2 eV or more.

With the configuration of Item 38, the spectral sensitivitycharacteristic of the photoelectric conversion structure can be changedby changing the potential difference applied across the first electrodeand the second electrode.

[Item 39]

The imaging device according to Item 37 or 38, wherein the firstmaterial and the second material are electron-donating molecules.

As described later with reference to the drawings, the imaging deviceaccording to a typical Embodiment of the present disclosure has an arrayof multiple imaging cells. Each of the imaging cells includes aphotoelectric converter supported by a semiconductor substrate, and acharge detector connected to the photoelectric converter. Thephotoelectric converter has a pixel electrode, an opposite electrode,and a photoelectric conversion structure. The charges generated by thephotoelectric conversion are temporarily held in a charge accumulationnode. The charge detector reads a charge held in the charge accumulationnode. The imaging device according to an Embodiment further includes avoltage supply circuit. The voltage supply circuit is connected to asignal line electrically coupled to pixel electrodes, and supplies atleast two voltages different from each other in absolute value to thesignal line.

The voltage supply circuit switches, for instance, the voltage appliedto the signal line between the first and second voltages that aredifferent from each other in absolute value. It is possible to changethe potential of the charge accumulation node by changing the potentialof the signal line. For instance, it is possible to make differencebetween the potential of the charge accumulation node immediately beforeaccumulation of a signal charge in an imaging cell, and the potential ofthe charge accumulation node immediately before accumulation of a signalcharge in another imaging cell by changing the potential of the signalline. For instance, the potential difference between the pixel electrodeand the opposite electrode is reduced by increasing the potential of thesignal line, and the sensitivity of a target imaging cell and thesensitivity of another imaging cell can be made different.

Hereinafter, Embodiments of the present disclosure will be described indetail. It is to be noted that each of the Embodiments described belowrepresents a comprehensive or specific example. The numerical values,shapes, materials, components, arrangement and connection topologies ofthe components, steps, the order of the steps which are presented in thefollowing Embodiments are examples, and not intended to limit thepresent disclosure. Various aspects described in the present descriptionmay be combined as long as no contradiction occurs. Any component whichis included in the components of the following Embodiments and is notrecited in the independent claim providing the most generic concept willbe described as an arbitrary component. In the following description,components having substantially the same function are labeled with acommon reference symbol, and a description may be omitted.

(Embodiment of Imaging Device)

FIG. 1 illustrates an overview of an exemplary configuration of animaging device according to Embodiments of the present disclosure. Animaging device 100 illustrated in FIG. 1 includes multiple imaging cells10. FIG. 1 representatively illustrates one of the multiple imagingcells 10. FIG. 1 schematically illustrates the arrangement of the unitsincluded in the imaging cell 10. The dimension in the units illustratedin FIG. 1 does not necessarily match the dimension in an actual device.This applies to other drawings of the present disclosure.

The imaging device 100 has a semiconductor substrate 50, and aninterlayer insulation layer 52 that covers the semiconductor substrate50. In the semiconductor substrate 50, multiple impurity regionsincluding an impurity region 50 a are formed. The imaging cell 10 has aphotoelectric converter PC that is supported by the semiconductorsubstrate 50 and the interlayer insulation layer 52. The imaging cell 10further has a charge detector CD that detects a signal charge generatedin the photoelectric converter PC. The charge detector CD includes theimpurity region 50 a which is one of the impurity regions formed in thesemiconductor substrate 50. As schematically illustrated in FIG. 1, theimpurity region 50 a is connected to the photoelectric converter PC by aconnector 54 disposed in the interlayer insulation layer 52.

The photoelectric converter PC is located above the semiconductorsubstrate 50. The photoelectric converter PC includes a pixel electrode61, an opposite electrode 62, and a photoelectric conversion structure64 interposed therebetween. In the instance illustrated in FIG. 1, acolor filter 72 and a microlens 74 are disposed above the oppositeelectrode 62. As a replacement for the color filter 72 or along with thecolor filter 72, an infrared transmissive filter, a protection layer, orthe like is disposed between the microlens 74 and the opposite electrode62.

The photoelectric conversion structure 64 in the photoelectric converterPC receives incident light, and generates positive and negative charges(typically positive hole-electron pair) by photoelectric conversion.When a potential difference is applied across the pixel electrode 61 andthe opposite electrode 62, positive and negative charges are movedaccording to the electric field generated between the pixel electrode 61and the opposite electrode 62. For instance, it is assumed that thepotential of the opposite electrode 62 is higher than the potential ofthe pixel electrode 61, and the potential difference Φ between theopposite electrode 62 and pixel electrode 61 is high to some extent. Inthis situation, the positive charges out of the positive and negativecharges generated in the photoelectric conversion structure 64 can becollected as signal charges by the pixel electrode 61. The collectedsignal charges are accumulated in the charge accumulation region whichincludes, in part, the connector 54 and the impurity region 50 a. Thecharge detector CD has a function of detecting a signal chargeaccumulated in the charge accumulation region.

In Embodiments of the present disclosure, at the time of operation ofthe imaging device 100, the potential difference between the oppositeelectrode 62 and the pixel electrode 61 can be changed. As schematicallyillustrated in FIG. 1, in an aspect, it is possible to change thepotential of the pixel electrode 61 by the change in the voltage appliedto a first signal line 31 connected to a voltage supply circuit 41. Inanother aspect, the potential of the opposite electrode 62 can bechanged by the change in the voltage applied to an accumulation controlline 32 connected to a voltage supply circuit 42. Specifically, asdescribed in detail later, in Embodiments of the present disclosure, thepotential difference Φ between the pixel electrode 61 and the oppositeelectrode 62 is controlled by positively changing the potential of atleast one of the pixel electrode 61 and the opposite electrode 62. Forinstance, the potential of the pixel electrode 61 and/or the oppositeelectrode 62 at the start of accumulation of signal charges iscontrolled to be different between the multiple imaging cells 10.

It is to be noted that in FIG. 1, it appears that the first signal line31 is connected to the pixel electrode 61. However, it is not requiredthat the first signal line 31 is physically connected to the pixelelectrode 61 by a wire. It is sufficient that the voltage of the pixelelectrode 61 can be positively changed by the change in the voltage ofthe first signal line 31. As describes later, electrical coupling may beformed between the first signal line 31 and pixel electrode 61 via acapacitor. Furthermore, a voltage change according to the change in thevoltage of the first signal line 31 may be generated in the pixelelectrode 61 via electrical coupling between the first signal line 31and pixel electrode 61. It is sufficient that the voltage of the pixelelectrode 61 can be changed. Thus, as illustrated by a dashed line inFIG. 1, the first signal line 31 may be electrically connected orcoupled to not only the pixel electrode 61 but also the connector 54 andthe impurity region 50 a which have connection to the pixel electrode61. A switching device such as a transistor may be interposed betweenthe first signal line 31 and the pixel electrode 61.

Embodiment 1

FIG. 2 illustrates an exemplary circuit configuration of an imagingdevice according to Embodiment 1 of the present disclosure. The imagingdevice 100A illustrated in FIG. 2 has a pixel array PA includingmultiple imaging cells 10A arranged two-dimensionally. FIG. 2schematically illustrates an instance in which imaging cells 10A arearranged in a matrix. FIG. 2 illustrates four imaging cells 10A arrangedin two rows by two columns, taken from the imaging cells 10A due tolimitations of space. Needless to say, the number and arrangement of theimaging cells 10A are not limited to the instance illustrated in FIG. 2.

Each of the imaging cells 10A has a photoelectric converter PC and acharge detector CD1. The charge detector CD1 is connected to the pixelelectrode 61 (see FIG. 1) of the photoelectric converter PC, and detectsa signal charge collected by the pixel electrode 61. In this instance,the charge detector CD1 has a signal detection transistor 21, a resettransistor 22, and an address transistor 23. These transistors aretypically field effect transistors (FET). Hereinafter an instance, inwhich N-channel MOS is used for the aforementioned transistors, will bedescribed.

The imaging device 100A has a vertical signal line 34 provided for eachcolumn of the multiple imaging cells 10A, and a power source wire 36 forsupplying power supply voltage AVDD to each imaging cell 10A. The drainof the signal detection transistor 21 is connected to the power sourcewire 36. The source of the signal detection transistor 21 is connectedto a corresponding vertical signal line 34 via the address transistor23.

As schematically illustrated in FIG. 2, the gate of the signal detectiontransistor 21 is connected to the photoelectric converter PC. Asdescribed later, the gate of the signal detection transistor 21 isconnected to the pixel electrode 61 of the photoelectric converter PC.The signal charges generated by the photoelectric converter PC aretemporarily accumulated in the charge accumulation region. The chargeaccumulation region includes a charge accumulation node (also called“floating diffusion node”) FD between the gate of the signal detectiontransistor 21 and the photoelectric converter PC. The signal detectiontransistor 21 outputs a signal which is generated by the photoelectricconverter PC with the power source wire 36 serving as a source followerpower supply. In other words, a voltage according to the signal chargesaccumulated in the charge accumulation region is read to the verticalsignal line 34. It is to be noted that the connection terminal of thesignal detection transistor 21 connected to the photoelectric converterPC is not limited to the gate electrode. For instance, the connectionterminal may be the source or the drain according to the circuitconfiguration of a charge detection circuit.

The vertical signal line 34 is connected to a column signal processingcircuit (also called a “row signal accumulation circuit”) 44. The columnsignal processing circuit 44 performs, for instance, noise suppressionsignal processing represented by Correlated Double Sampling, andanalog-to-digital conversion (A/D conversion). The column signalprocessing circuit 44 is provided for each row of the imaging cells 10Ain the pixel array PA. These column signal processing circuits 44 areconnected to a horizontal signal read circuit (also called a “columnscanning circuit”) 46. The horizontal signal read circuit 46successively reads signals from multiple column signal processingcircuits 44 to a horizontal common signal line 45.

The imaging device 100A further has a first voltage supply circuit 41and a second voltage supply circuit 42. The first voltage supply circuit41 is connected to the first signal line 31. The first signal line 31 iselectrically coupled to the pixel electrode 61 of the imaging cell 10A.In the configuration illustrated in FIG. 2, the first signal line 31 isconnected to the source of the reset transistor 22. The drain of thereset transistor 22 is connected to the charge accumulation node FD. Inother words, in this example, the voltage supply circuit 41 supplies areset voltage V_(RST) for resetting the potential of the chargeaccumulation node FD to each imaging cell 10A. In the presentdescription, “electrical coupling” refers to a relationship in whichpositive variation in one of voltages induces a variation in the othervoltage. The “electrical coupling” is interpreted to broadly include notonly direct connection by a wire, and connection via a device such as atransistor, but also connection in the form of no current path, such asconnection via a capacitor.

The voltage supply circuit 41 is configured to switch between multiplevoltages with different absolute values and to allow a voltage to beapplied to the first signal line 31. In the instance illustrated in FIG.2, the first signal line 31 is connected to the reset transistor 22 ofeach imaging cell 10A. Therefore, in this example, the voltage supplycircuit 41 selectively supplies one of multiple voltages with differentabsolute values to each imaging cell 10A as the reset voltage V_(RST).For instance, at the time of operation of the imaging device 100A, thevoltage supply circuit 41 applies the first reset voltage to the firstsignal line 31 in a certain period, and applies the second reset voltagedifferent from the first reset voltage in absolute value to the firstsignal line 31 in another period. It is to be noted that the firstsignal line 31 is not limited to a single wire. The first signal line 31may be a structure that is electrically coupled or connected to a targetimaging cell, and may be a grid-shaped structure, for instance. Thisapplies to other voltage lines, signal lines, control lines, and wiresin the present disclosure. In the present description, the term “line”or “wire” used as the name of a member is only for the sake ofconvenience of description, and it is not intended to limit a specificstructure, such as a voltage line, a signal line, a control line, and awire, to a single linear conductor.

The voltage supply circuit 42 is connected to the accumulation controlline 32 which is connected to the photoelectric converter PC of eachimaging cell 10A. As described later, the accumulation control line 32is connected to the opposite electrode 62 (see FIG. 1) of thephotoelectric converter PC. Therefore, the voltage supply circuit 42 cansupply a predetermined voltage V_(OPP) to the opposite electrode 62 ofthe photoelectric converter PC of each imaging cell 10A via theaccumulation control line 32. Similarly to the first signal line 31, theaccumulation control line 32 may be a structure that is electricallycoupled or connected to a target imaging cell. That is, the accumulationcontrol line 32 is not limited to a single wire, and may be agrid-shaped structure, for instance. Hereinafter, for the sake ofconvenience of description, the voltage V_(OPP) supplied by the voltagesupply circuit 42 may be called “opposite electrode voltage V_(OPP)”. Inan aspect, the opposite electrode voltage V_(OPP) is fixed to a certainvoltage at the time of operation of the imaging device 100A.

The imaging device 100A has a reset signal line 38 and an address signalline 39 which are provided for each row of the imaging cell 10A. Thereset signal line 38 and the address signal line 39 are connected to avertical scanning circuit (called a “row scanning circuit”) 48. Asillustrated, the reset signal line 38 is connected to the gate of thereset transistor 22 of each of multiple imaging cells 10A belonging tothe same row. The vertical scanning circuit 48 controls the potential ofthe reset signal line 38 and turns on the reset transistor 22, therebymaking it possible to collectively reset the potentials of the chargeaccumulation nodes FD of the imaging cells 10A belonging to the samerow. The address signal line 39 is connected to the gate of the addresstransistor 23 of each of the multiple imaging cells 10A belonging to thesame row. The vertical scanning circuit 48 can select the multipleimaging cells 10A belonging to the same row on a row-by-row basis bycontrolling the potential of the address signal line 39. The multipleimaging cells 10A belonging to the same row are selected on a row-by-rowbasis, thus the outputs of the signal detection transistors 21 of theimaging cells 10A belonging to the same row can be collectively read toa corresponding vertical signal line 34.

FIG. 3 illustrates an instance of electrical coupling between the firstsignal line 31 and the pixel electrode 61. FIG. 3 schematicallyillustrates the circuit configuration of one of the imaging cells 10A inthe pixel array PA.

In the configuration illustrated in FIG. 3, the charge detector CD1 ofthe imaging cell 10A includes a reset circuit RS1, a read circuit RD,and a row selection circuit SL. The reset circuit RS1 includes a resettransistor 22 in which one of the source and the drain is connected tothe pixel electrode 61. The reset circuit RS1 is not limited to acircuit including the reset transistor 22. The reset circuit RS1 may beconfigured to allow the potential of the charge accumulation node FD tobe reset to a desired potential by using a voltage supplied from theoutside, such as a power supply voltage. The read circuit RD is a sourcefollower that includes, for instance, the signal detection transistor 21and the power source wire 36. The row selection circuit SL is, forinstance, the address transistor 23.

In this instance, the other of the source and the drain of the resettransistor 22 is connected to the first signal line 31, thus the pixelelectrode 61 and the first signal line 31 are electrically coupled toeach other via the reset transistor 22. With such a circuitconfiguration, by turning on the reset transistor 22, the potential ofthe charge accumulation node FD can be reset to a desired voltage levelby using the reset voltage V_(RST) applied to the first signal line 31by the voltage supply circuit 41.

(Instance of Operation of Imaging Device)

FIG. 4 illustrates an instance of the operation when a rolling shutteris applied to the imaging device 100A illustrated in FIG. 2. In FIG. 4,rectangular arrangements in the second, third, and fourth stagesschematically represent the operation of the imaging cells 10A belongingto the first, second, and third rows of the pixel array PA,respectively. It is to be noted that the actual number of rows includedin the pixel array PA may reach several hundred to several thousandrows. Here, just three rows are taken and illustrated due to limitationsof space.

As described above, the voltage supply circuit 41 is configured to allowone of at least two voltages with different absolute values to beselectively applied to the first signal line 31. Here, the voltagesupply circuit 41 is configured to allow the reset voltage V_(RST) to beapplied to the first signal line 31 by switching between a first voltageV_(H) and a second relatively low voltage V_(L). For instance, the powersupply voltage, or a voltage decreased (or increased) from the powersupply voltage may be used as the first voltage V_(H). This applies tothe second voltage V_(L). In this case, the voltage supply circuit 41may be part of the voltage supply circuit (not illustrated in FIG. 2)that supplies the power supply voltage to each imaging cell 10A.Hereinafter, the voltage level corresponding to the voltage V_(H) isrepresented by high-level for convenience, and the voltage levelcorresponding to the voltage V_(L) is represented by low-level forconvenience. It is to be noted that the terms “high-level” and“low-level” only represent the height of potential relatively, and it isnot intended to indicate that high-level is equivalent to the powersupply voltage.

In this instance, it is assumed that the opposite electrode voltageV_(OPP) applied from the voltage supply circuit 42 to the accumulationcontrol line 32 is fixed to a certain voltage V₁. In FIG. 4, the shadedrectangle in the uppermost stage indicates that the opposite electrodevoltage V_(OPP) at the time of operation of the imaging device 100A isfixed to the voltage V₁. However, in Embodiments of the presentdisclosure, it is not required that the opposite electrode voltageV_(OPP) be a fixed value, and as described later, it is naturallypossible to perform control to cause the opposite electrode voltageV_(OPP) to be changed.

First, attention is focused on the rectangular arrangement in the secondstage in FIG. 4. When an image signal is obtained, first, the potentialof the charge accumulation node FD is reset. In other words, the chargein the charge accumulation node FD is discharged. Specifically, in theconfiguration exemplified to FIG. 2, the reset transistor 22 is turnedon. Here, at this point, the voltage supply circuit 41 applies thehigh-level voltage V_(H) to the first signal line 31 as the resetvoltage V_(RST). Therefore, the voltage V_(H) is applied to the chargeaccumulation node FD, and the potential of the pixel electrode 61 isreset to a level according to the voltage V_(H). The voltage level ofthe pixel electrode 61 then determines a level of the image signal at adark time. The first reset period corresponds to what is called anelectronic shutter. In FIG. 4, a hatched rectangle RT1 at the left endrepresents the first reset period.

Next, the reset transistor 22 is turned off. Accumulation of signalcharges in the charge accumulation node FD is started by turning off thereset transistor 22. Subsequently, the address transistor 23 is turnedon at a desired timing, and a signal is read to the vertical signal line34. The level of a signal read at this point corresponds to the amountof signal charges accumulated in the charge accumulation region in theperiod from the initial reset of the charge accumulation node FD untilturning on of the address transistor 23. In FIG. 4, a lightly hatchedrectangle RD1 represents a period in which a signal is read (firstsignal read period) according to the amount of signal chargesaccumulated in the charge accumulation region. In FIG. 4, a whiterectangle EXP represents a period from a state of dark level of thepotential of the charge accumulation node FD until the first signal readperiod. In the present description, the signal read period is called an“charge accumulation period”. The charge accumulation period is a periodin which signal charges are essentially accumulated in the chargeaccumulation region, and may also be called an exposure period.

After a signal is read, the reset transistor 22 is turned on again, andthe potential of the pixel electrode 61 is again reset to a levelaccording to the voltage V_(H). In FIG. 4, a hatched rectangle RT2represents the reset period following the first signal read period.

Subsequently, the address transistor 23 is turned on again, and a signalafter the reset is read again. The level of a signal read herecorresponds to a level at a dark time. Thus, an image signal with fixednoise removed is obtained by calculating the difference between thelevel of a signal read at this point and the level of a signal read inthe first signal read period represented by the rectangle RT1. In FIG.4, a relatively dark hatched rectangle RD2 represents a period in whicha signal is read (second signal read period) after the potential of thecharge accumulation node FD is reset. After a signal corresponding to alevel at a dark time, the address transistor 23 is turned off. The timetaken for reading a signal is relatively short, thus the potential ofthe charge accumulation region hardly changes before and after thesignal is read.

After the second signal read period is completed, the subsequent chargeaccumulation period starts. After the second signal read period iscompleted, an electronic shutter may be operated again before thesubsequent signal accumulation period. In a rolling shutter operation,the above-mentioned operation is successively performed for each row inthe pixel array PA with start timing shifted.

Attention is focused on the rectangular arrangement in the third stagein FIG. 4. In the second row of the pixel array PA, a low-level voltageV_(L) is supplied to the imaging cell 10A in the first reset period. Inother words, in the electronic shutter operation for the second row, thevoltage supply circuit 41 switches the voltage applied to the firstsignal line 31 from the voltage V_(H) to the voltage V_(L). Therefore,the imaging cell 10A belonging to the second row of the pixel array PAis reset by a reset voltage different from the reset voltage for theimaging cell 10A belonging to the first row of the pixel array PA. Inother words, the level of an image signal at a dark time of the imagingcell 10A belonging to the second row of the pixel array PA is differentfrom the level of an image signal at a dark time of the imaging cell 10Abelonging to the first row of the pixel array PA.

Subsequently, accumulation of signal charges is started. In FIG. 4, thewhite rectangle EXP represents a charge accumulation period. Here, inthe second row of the pixel array PA, the voltage applied to the firstsignal line 31 is switched from the voltage V_(H) to the voltage V_(L).Thus, the potential of the pixel electrode 61 at the start ofaccumulation of signal charges is different between the imaging cell 10Abelonging to the first row of the pixel array PA, and the imaging cell10A belonging to the second row. Specifically, the potential differenceΦ between the pixel electrode 61 and the opposite electrode 62 at thestart of the charge accumulation period for the imaging cell 10Abelonging to the second row of the pixel array PA is greater than thepotential difference Φ at the start of the charge accumulation periodfor the imaging cell 10A belonging to the first row of the pixel arrayPA. In other words, the sensitivity of the imaging cell 10A belonging tothe second row of the pixel array PA is a higher than the sensitivity ofthe imaging cell 10A belonging to the first row of the pixel array PA.Therefore, an image signal, which is obtained with a relatively highsensitivity, is outputted from the imaging cell 10A belonging to thesecond row of the pixel array PA.

When attention is focused on the rectangular arrangement in the fourthstage in FIG. 4, the voltage supply circuit 41 switches the voltagesupplied to the first signal line 31 to the high-level voltage V_(H)again in the first reset period for the imaging cell 10A belonging tothe third row of pixel array PA. Similarly to the imaging cell 10Abelonging to the first row, an image signal, which is obtained with arelatively low sensitivity, is outputted from the imaging cell 10Abelonging to the third row of the pixel array PA.

FIG. 5A schematically illustrates arrangement of imaging cells 10A withdifferent sensitivities when a reset voltage V_(RST) is switched betweena voltage V_(H) and a voltage V_(L) row by row in the pixel array PA. InFIG. 5A, each hatched rectangle represents an imaging cell 10A withsensitivity relatively reduced. As in this example, the voltage supplycircuit 41 switches the reset voltage V_(RST) between the voltage V_(H)and the voltage V_(L) row by row in the pixel array PA. In this case, anoutput, in which an image signal obtained by an imaging cell having arelatively low sensitivity, and an image signal obtained by an imagingcell having a relatively high sensitivity are interleaved row by row, isobtained. In this instance, when the outputs of the imaging cells 10A inthe odd rows are extracted, images obtained by photographing with arelatively low sensitivity can be constructed, and when the outputs ofthe imaging cells 10A in the even rows are extracted, images obtained byphotographing with a relatively high sensitivity can be constructed. Inshort, multiple image signals obtained with different sensitivities canbe acquired by single photographing. Like this, according to Embodimentsof the present disclosure, it is not necessary to perform processingcorresponding to exposure correction after signals are obtained, forinstance, processing of amplifying signals by changing the gain row byrow, and multiple image signals obtained with different sensitivitiescan be acquired. Here, although an instance has been described, in whichthe voltage applied to the first signal line 31 is switched between twovoltages with different absolute values, the voltage applied to thefirst signal line 31 may be switched between three or more voltages withdifferent absolute values on a row-by-row basis, for instance.

The reset voltage V_(RST) may be in common with all the imaging cells10A included in the pixel array PA. When the reset voltage V_(RST) is incommon with all the imaging cells 10A included in the pixel array PA, itis possible to change the sensitivity of all the imaging cells 10A atonce. For instance, when the reset voltage V_(RST) is switched from thevoltage V_(L) to the voltage V_(H) for all the imaging cells 10Aincluded in the pixel array PA, each of the imaging cells 10A includedin the pixel array PA can be switched to a state with a relatively lowsensitivity.

FIG. 5B schematically illustrates the sensitivity of the imaging cells10A when the reset voltage V_(RST) is switched from the voltage V_(H) tothe voltage V_(L) for all the imaging cells 10A included in the pixelarray PA. In FIG. 5B, each hatched rectangle represents an imaging cell10A with sensitivity relatively reduced. When the reset voltage V_(RST)is switched from the voltage V_(L) to the voltage V_(H) for all theimaging cells 10A included in the pixel array PA, all the sensitivitiesof the imaging cells 10A included in the pixel array PA are returned toa relatively high sensitivity. For instance, when the reset voltageV_(RST) is switched between frames for all the imaging cells 10Aincluded in the pixel array PA, an image signal obtained by an imagingcell having a relatively low sensitivity, and an image signal obtainedby an imaging cell having a relatively high sensitivity are switched foreach frame and can be obtained. When sufficient light is incident intoimaging cells like outdoors in daytime, all the imaging cells may beswitched to a relatively low sensitivity state, and when an amount ofincident light is small, all the imaging cells may be switched to arelatively high sensitivity state. In this manner, the sensitivity maybe flexibly switched according to an amount of incident light. Fordetermination of daytime or nighttime, and detection of an amount ofincident light, external information, for instance, time information oran output of other sensor, such as an illuminance sensor, may be used.

Alternatively, the voltage supplied to all the imaging cells 10Aincluded in the pixel array PA via the first signal line 31 may beswitched in an analog manner. Switching in an analog manner refers to,for instance, changing without step. The sensitivity of the entireimaging region can be changed in an analog manner by changing thevoltage applied to the first signal line 31 in an analog manner.

The reset voltage V_(RST), which causes the potential difference Φbetween the pixel electrode 61 and the opposite electrode 62 to assume avalue near 0 V, may be supplied in common with all the imaging cells 10Ain the pixel array PA. As described later, a configuration of thephotoelectric conversion structure 64 may be adopted, in which when thepotential difference Φ is small to some extent, the photoelectricconversion structure 64 exhibits characteristics such that charges arenot moved between the photoelectric conversion structure 64 and theelectrode (the pixel electrode 61 or the opposite electrode 62). Thus, astate with sensitivity of zero can be achieved. The sensitivity of allthe imaging cells 10A in the pixel array PA can be set to substantially0 by causing the potential difference Φ between the pixel electrode 61and the opposite electrode 62 to be closer to 0 V. In other words, astate with a shutter closed for all the imaging cells 10A in the pixelarray PA can be electrically achieved.

(Change of Sensitivity in Unit of Imaging Cell)

As described with reference to FIG. 1, typically, the common addresssignal line 39 is connected to the gates of the reset transistors 22 ofthe imaging cells 10A belonging to the same row. That is, reset of theimaging cell 10 included in the pixel array PA is typically executed ona row-by-row basis. Therefore, when the voltage supply circuit 41alternately switches the reset voltage V_(RST) applied to the firstsignal line 31 row by row, as illustrated in FIG. 5A, the imaging cells10A with different sensitivities are alternately arranged row by row. Itis more useful if the sensitivities between the imaging cells 10belonging to the same row can be made different from each other ratherthan the sensitivities are made different row by row. Hereinafter, aninstance of configuration will be described, in which the voltagewritten to the pixel electrode 61 can be made different between part ofthe imaging cells in the pixel array PA and the other imaging cells.

FIG. 6 schematically illustrates an overview of configuration in which avoltage written to the pixel electrode 61 is controllable imaging cellby imaging cell. For instance, it is assumed that multiple imaging cellsin a matrix form are arranged in a direction in which the rows of themultiple imaging cells extend (hereinafter simply called a “rowdirection”), and in a direction in which the columns extend (hereinaftersimply called a “column direction”). At this point, multiple row signallines extending in the row direction, and multiple row signal linesextending in the column direction may be provided in the pixel array PAcorresponding to the multiple imaging cells arranged in a matrix form.

FIG. 6 illustrates part of one imaging cell 10 of the imaging cells 10in the pixel array PA. A corresponding one of multiple row signal linesRd and a corresponding one of column signal lines Cd arerepresentatively illustrated. Each of the row signal lines Rd isconnected to a row driver (not illustrated in FIG. 6), and apredetermined control signal is applied to each row signal line Rd froma row driver at a predetermined timing. The row driver may be part ofthe vertical scanning circuit 48. Similarly, each of the column signallines Cd is connected to a column driver (not illustrated in FIG. 6),and a predetermined control signal is applied to each column signal lineCd from a column driver at a predetermined timing.

In the instance illustrated in FIG. 6, the selection circuit 43 islocated at an intersection point at which the row signal line Rd and thecolumn signal line Cd intersect each other. In the configurationexemplified to FIG. 6, the selection circuit 43 switches between ON andOFF of a switching device 43 s connected between the charge accumulationnode FD and the first signal line 31 according to the voltage levels ofthe row signal line Rd and the column signal line Cd. For instance, whena high-level signal is applied to the row signal line Rd from the rowdriver, and a high-level signal is applied to the column signal line Cdfrom the column driver the selection circuit 43 turns on the switchingdevice 43 s.

The switching device 43 s is, for instance, the reset transistor 22described above. The selection circuit 43 turns on the reset transistor22, thereby establishing the connection between the charge accumulationnode FD and the first signal line 31. Thus, the potential of pixelelectrode 61 can be reset to a voltage level corresponding to the resetvoltage V_(RST) applied to the first signal line 31 from the voltagesupply circuit 41. It is to be noted that although in FIG. 6, one end ofthe switching device 43 s is connected to the connector 54, FIG. 6schematically illustrates the connection of the switching device 43 s.It is not necessary that one end of the switching device 43 s isphysically connected to the connector 54 actually.

For instance, when the signal applied to the row signal line Rd is setto high-level in every other row, and the signal applied to the columnsignal line Cd is set to high-level in every other column at a certaintiming, the pixel electrode 61 of an imaging cell 10 located at anintersection point of the row signal line Rd and the column signal lineCd with high-level signal can be reset to a common potential. Forinstance, the potential of the pixel electrode 61 can be reset to avoltage level corresponding to the high-level voltage V_(H).

Subsequently, the applied signal is switched between high-level andlow-level, and the reset voltage V_(RST) applied to the first signalline 31 from the voltage supply circuit 41 is switched to the low-levelvoltage V_(L), and thereby the potential of the pixel electrode 61 ofeach of the remaining imaging cells 10 can be reset to a voltage levelcorresponding to the low-level voltage V_(L).

FIG. 7 illustrates an instance in which imaging cells for which voltageswritten to pixel electrodes 61 are different are mixed in the rowdirection and the column direction. Similarly to FIGS. 5A and 5B, eachhatched rectangle in FIG. 7 represents an imaging cell 10 withsensitivity relatively reduced. By disposing the selection circuit 43 ineach imaging cell 10, different reset voltages V_(RST) can bealternately applied to the imaging cell 10, for instance, in the rowdirection and the column direction. Therefore, as schematicallyillustrated in FIG. 7, it is possible to alternately arrange imagingcells 10 with different sensitivities in the row direction and thecolumn direction. In this manner, according to Embodiments of thepresent disclosure, the potential of the pixel electrode 61 iscontrolled by changing the voltage applied to the first signal line 31,for instance. Thus, the sensitivity of each imaging cell can be changedon an imaging cell-by-imaging cell basis. With such an imaging device,for instance, even at the same time, an imaging cell with a relativelylarge amount of incident light can be switched to a relatively lowsensitivity state, and an imaging cell with a relatively small amount ofincident light can be switched to a relatively high sensitivity state.

FIG. 8 illustrates an instance of a specific configuration of theselection circuit 43. In the instance illustrated in FIG. 8, an AND gateis used as the selection circuit 43A, and the reset transistor 22 isused as the switching device 43 s. In this instance, the output of theAND gate is connected to the gate of the reset transistor 22, and whenthe signal levels of the row signal line Rd and the column signal lineCd are both high-level, the connection between the first signal line 31and the charge accumulation node FD is established. As a replacement forAND gate, NAND gate is used, and the number of devices in the selectioncircuit 43 can be reduced by using P-channel MOS as the switching device43 s.

FIG. 9 illustrates another instance of a specific configuration of theselection circuit 43. In the instance illustrated in FIG. 9, N-channelMOS is used as the selection circuit 43B. The number of devices can befurther reduced by using a transistor as the selection circuit 43. Thegate and the drain of a transistor serving as the selection circuit 43Bare connected to the row signal line Rd and the column signal line Cd,respectively. According to this example, the operation of active matrixsystem can be achieved by two transistors.

Similarly to the active matrix system, an imaging cell at any positionin the pixel array PA can be selected by providing the selection circuit43 in each imaging cell. Application of a voltage to a selected imagingcell from the first signal line 31 allows the potential of the pixelelectrode 61 of the imaging cell to be changed. The direction ofextension of the signal line (for instance, the row signal line Rd andthe column signal line Cd) for selecting an imaging cell 10 to which avoltage is applied from the first signal line 31 is not limited to therow direction and the column direction, and may be changed as neededaccording to the arrangement of the multiple imaging cells 10.

The opposite electrode 62 may be electrically separated for each imagingcell 10, for instance. Furthermore, when the reset voltage V_(RST) iswritten to the pixel electrode 61, an opposite electrode voltageV_(OPP), which causes the potential difference Φ between the pixelelectrode 61 and the opposite electrode 62 to assume a value near 0 V,may be applied to the opposite electrode 62 of each imaging cell 10according to the voltage written to the pixel electrode 61. InEmbodiments of the present disclosure, a configuration of thephotoelectric conversion structure 64 is adopted, in which when thepotential difference Φ between the pixel electrode 61 and the oppositeelectrode 62 is small to some extent, the photoelectric conversionstructure 64 exhibits characteristics such that charges are not movedbetween the photoelectric conversion structure 64 and the electrode (thepixel electrode 61 or the opposite electrode 62). The details of theconfiguration of the photoelectric conversion structure 64, which givessuch a characteristic, will be described later.

When the photoelectric conversion structure 64 has such acharacteristic, adjustment of the potential of at least one of the pixelelectrode 61 and the opposite electrode 62 can achieve a state in whichsubstantially, accumulation of charges from the photoelectric conversionstructure 64 to the charge accumulation region does not occur, anddrawing out of charges from the charge accumulation region to thephotoelectric conversion structure 64 does not occur. That is, a stateis achieved, in which even when the photoelectric conversion structure64 is irradiated with light, no signal charge is accumulated in thecharge accumulation region, and the signal charges already accumulatedin the charge accumulation region are not drawn out by the photoelectricconversion structure 64. In other words, a state with sensitivity ofzero can be achieved. When the reset voltage V_(RST) is written to thepixel electrode 61, it is useful to set the imaging cell 10 to a statewith sensitivity of zero because accumulation of signal charges does notstart while the reset voltage V_(RST) is being written to the pixelelectrode 61.

(Device Structure of Imaging Cell)

Here, the device structure of the imaging cell will be described indetail with reference to FIG. 10. FIG. 10 schematically illustrates anexemplary device structure of the imaging cell 10A. As illustrated inFIG. 10, each of the multiple imaging cells 10A includes part of thesemiconductor substrate 50. The interlayer insulation layer 52, whichcovers the semiconductor substrate 50, is typically a silicon dioxidelayer, and may have a multilayer structure of multiple insulationlayers. The semiconductor substrate 50 is not limited to a substratewhich is a semiconductor layer in its entirety, and may be an insulationsubstrate in which a semiconductor layer is provided on the surface onwhich the photoelectric converter PC is disposed. Hereinafter, P-typesilicon (Si) substrate is exemplified as the semiconductor substrate 50.

The semiconductor substrate 50 has impurity regions (here, N-typeregions) 50 a to 50 e, and a device separation region 50 s forelectrical separation between the imaging cells 10A. The impurityregions 50 a to 50 e are typically diffusion layers formed in thesemiconductor substrate 50. The device separation region 50 s is formedby, for instance, ion implantation of donor on predeterminedimplantation conditions. In this instance, the device separation region50 s is also provided between the impurity region 50 a and the impurityregion 50 b. It is to be noted that the center-to-center distance (pixelpitch) between two adjacent imaging cells 10A in the row direction orthe column direction of the multiple imaging cells 10A may be on theorder of 2 μm, for instance.

The above-described signal detection transistor 21 includes the impurityregions 50 b and 50 c formed in the semiconductor substrate 50, and agate electrode 21 g (typically a polysilicon electrode) positioned abovethe region between the impurity regions 50 b and 50 c out of the majorsurface of the semiconductor substrate 50. The impurity regions 50 b and50 c respectively serve as the drain region and the source region of thesignal detection transistor 21. Although not illustrated in FIG. 10, theimpurity region 50 b is connected to the power source wire 36 (see FIG.2).

As schematically illustrated in FIG. 10, the gate electrode 21 g of thesignal detection transistor 21 is connected to the pixel electrode 61and the impurity region 50 a via the connector 54 disposed in theinterlayer insulation layer 52. In the instance illustrated, theconnector 54 includes a contact plug 54 a having one end connected tothe gate electrode 21 g, a contact plug 54 b having one end connected tothe impurity region 50 a, a wiring layer 54 c, and a plug 54 d. Thewiring layer 54 c connects the other ends of the contact plugs 54 a and54 b. The pixel electrode 61, the connector 54, and the impurity region50 a form at least part of the charge accumulation region.

The contact plugs 54 a, 54 b and the wiring layer 54 c are typicallycomposed of polysilicon. The plug 54 d disposed between the wiring layer54 c and the pixel electrode 61 is composed of copper, for instance. Itis to be noted that in addition to the connector 54, a wiring layer 56including the vertical signal line 34 (see FIG. 2) is disposed in theinterlayer insulation layer 52. The number of insulation layers in theinterlayer insulation layer 52, and the number of wiring layers 56disposed in the interlayer insulation layer 52 can be set to any number.

In the semiconductor substrate 50, not only the signal detectiontransistor 21, but also other transistors, such as the addresstransistor 23, and the reset transistor 22 are also formed. The addresstransistor 23 includes the impurity regions 50 c and 50 d, and a gateelectrode 23 g (typically a polysilicon electrode) positioned above theregion between the impurity regions 50 c and 50 d out of the majorsurface of the semiconductor substrate 50. The gate electrode 23 g isconnected to the address signal line 39 (not illustrated in FIG. 10, seeFIG. 2). The impurity regions 50 c and 50 d respectively serve as thedrain region and the source region of the address transistor 23. Here,the address transistor 23 is electrically connected to the signaldetection transistor 21 by sharing the impurity region 50 c with thesignal detection transistor 21. The impurity region 50 d is connected tothe vertical signal line 34 via a plug which is not illustrated in FIG.10.

The reset transistor 22 includes the impurity regions 50 a and 50 e, anda gate electrode 22 g (typically a polysilicon electrode) which ispositioned above the region between the impurity regions 50 a and 50 eand is connected to the reset signal line 38 (see FIG. 2). The impurityregion 50 a serves as one of the drain region and the source region ofthe reset transistor 22, and the impurity region 50 e serves as theother of the drain region and the source region of the reset transistor22. In this instance, the impurity region 50 e is connected to the firstsignal line 31.

The opposite electrode 62 of the photoelectric converter PC is typicallya transparent electrode composed of a transparent conductive material,and is disposed on the light incident side of the photoelectricconversion structure 64. In other words, the opposite electrode 62 ispositioned more distant from the semiconductor substrate 50 than thepixel electrode 61. For instance, transparent conducting oxide (TCO),such as ITO, IZO, AZO, FTO, SnO₂, TiO₂, ZnO₂ may be used as the materialof the opposite electrode 62. It is to be noted that “transparent” inthe present description means that at least part of light with awavelength range to be detected can transmit, and it is not requiredthat light can transmit for the entire wavelength range of visiblelight. In the present description, visible light refers to light with awavelength in a range of 380 nm or greater and less than 750 nm. In thepresent description, entire electromagnetic wave including infraredlight and ultraviolet rays is represented by “light” for the sake ofconvenience. The light detected by the imaging device in the presentdisclosure is not limited to the light with a wavelength range ofvisible light.

As schematically illustrated in FIG. 10, the opposite electrode 62 isconnected to the voltage supply circuit 42 via the accumulation controlline 32. The voltage supply circuit 42 applies a voltage, which makesthe potential of the opposite electrode 62 higher than the potential ofthe pixel electrode 61, to the opposite electrode 62, for instance. Bymaking the potential of the opposite electrode 62 higher than thepotential of the pixel electrode 61, the positive charges out of thepositive and negative charges generated in the photoelectric conversionstructure 64 can be collected by the pixel electrode 61. Hereinafter, acase will be illustrated where a positive hole is utilized as a signalcharge. Needless to say, it is also possible to utilize an electron as asignal charge. When an electron is utilized as signal charge, it is onlynecessary to perform control to make the potential of the oppositeelectrode 62 lower than the potential of the pixel electrode 61.

In this instance, the opposite electrode 62 is a single electrode overthe multiple imaging cells 10A. Therefore, it is possible to apply avoltage with desired amplitude collectively from the voltage supplycircuit 42 to the opposite electrode 62 of the multiple imaging cells10A via the accumulation control line 32. However, it is not requiredthat the opposite electrode 62 is a single electrode facing the multipleimaging cells 10A. As described later, the opposite electrode 62 may bedivided into multiple portions.

In the configuration illustrated in FIG. 10, the photoelectricconversion structure 64 is also formed over the multiple imaging cells10A. Like this, the entire photoelectric-converter PC does not have tobe an independent device for each imaging cell 10A, and part of thephotoelectric converter PC may be formed over the multiple imaging cells10A.

The pixel electrode 61 is typically provided independently for eachimaging cell 10A. The pixel electrode 61 is spatially separated from thepixel electrode 61 of another adjacent imaging cell 10A. Thus, the pixelelectrode 61 is electrically separated from the pixel electrode 61 ofanother imaging cell 10A. The pixel electrode 61 is composed of metalsuch as aluminum, copper, and titanium, metal nitride, or polysilicon towhich conductivity is imparted by doping impurities. The pixel electrode61 may be a single electrode or may include multiple electrodes. Thepixel electrode 61 may be a light-blocking electrode.

The signal charges (for instance, positive holes) collected by the pixelelectrode 61 are accumulated in a charge accumulation region includingthe charge accumulation node FD. The accumulation of signal charges inthe charge accumulation node FD causes a voltage according to the amountof the accumulated signal charges to be applied to the gate of thesignal detection transistor 21. A voltage amplified by the signaldetection transistor 21 is selectively read in the form of signalvoltage via the address transistor 23. It is to be noted that the chargeaccumulation region may include a capacitor, for instance. That is, thecharge detector CD may include not only the impurity region 50 a inwhich signal charges are accumulated, but also a capacitor (notillustrated in FIG. 10) in which signal charge can be accumulated, forinstance.

In Embodiments of the present disclosure, the pixel electrode 61, andthe first signal line 31 connected to the voltage supply circuit 41 areelectrically coupled to each other. This causes a change in thepotential of the charge accumulation node FD including the pixelelectrode 61 through a change in the voltage of the first signal line31. As described above, the voltage supply circuit 41 is configured toswitch between at least two voltages with different absolute values andto allow a voltage to be applied to the first signal line 31. Therefore,at the time of operation of the imaging device 100A, the voltage supplycircuit 41 can change the potential of the pixel electrode 61 byswitching a voltage applied to the first signal line 31 between multiplevoltages via electrical coupling between the pixel electrode 61 and thefirst signal line 31.

(Another Example that Allows Potentials of Pixel Electrodes after Resetto be Different)

A configuration that allows the potential of the pixel electrode 61after reset to be different between the multiple imaging cells 10 is notlimited to the configuration described with reference to FIG. 2. FIG. 11illustrates another exemplary circuit configuration of the imagingdevice according to Embodiment 1 of the present disclosure. An imagingdevice 100B illustrated in FIG. 11 has an imaging cell 10B instead ofthe above-described imaging cell 10A.

The imaging device 100B has an inverting amplifier 49 for each column ofmultiple imaging cells 10B. An inverting input terminal of the invertingamplifier 49 is connected to the vertical signal line 34 of acorresponding column, and an output terminal of the inverting amplifier49 is connected to a feedback line 33. The feedback line 33 is connectedto the source of the reset transistor 22 of each of the imaging cells10B belonging to a corresponding row. As seen from FIG. 11, one of theimaging cells 10B belonging to a corresponding column is selected, andthe reset transistor 22 and the address transistor 23 are turned on.Thus, it is possible to form a feedback loop for causing negativefeedback of the signal generated by the photoelectric converter PC ofthe imaging cell 10B. The effect of random noise can be canceled byutilizing the negative feedback as described in InternationalPublication No. WO 2014/002367.

In the instance illustrated in FIG. 11, the first signal line 31connected to the voltage supply circuit 41 is connected to anon-inverting input terminal of the inverting amplifier 49 in eachcolumn. In the configuration illustrated to FIG. 11, at the time ofoperation of the imaging device 100B, the voltage supply circuit 41supplies a reference voltage V_(REF) for resetting the potential of thecharge accumulation node FD to the inverting amplifier 49 in each columnvia the first signal line 31.

FIG. 12 illustrates an overview of the circuit configuration of oneimaging cell 10B in the pixel array PA. In the configuration illustratedto FIG. 12, a reset circuit RS2 of the imaging cell 10B includes afeedback circuit FC for causing negative feedback of the signalgenerated by the photoelectric converter PC. The feedback circuit FCincludes the inverting amplifier 49. The inverting input terminal of theinverting amplifier 49 is electrically connected to the source of thesignal detection transistor 21 via the vertical signal line 34 and theaddress transistor 23.

When the reset transistor 22 and the address transistor 23 are turnedon, a feedback loop including the inverting amplifier 49 in the path isformed. Due to the formation of a feedback loop, the voltage of thecharge accumulation node FD converges to a voltage that causes zerovoltage difference between the voltage of the vertical signal line 34,and the voltage applied to the non-inverting input terminal of theinverting amplifier 49. Here, the non-inverting input terminal of theinverting amplifier 49 is connected to the first signal line 31.Therefore, at the time of formation of a feedback loop, the voltage ofthe charge accumulation node FD converges to a voltage that equate thevoltage of the vertical signal line 34, and the reference voltageV_(REF) supplied to the first signal line 31 from the voltage supplycircuit 41. In short, the potential of the charge accumulation node FDis reset to a predetermined potential.

In the configuration illustrated in FIGS. 11 and 12, the voltage levelof the pixel electrode 61 that gives a level of image signal at a darktime is dependent on and determined by the reference voltage V_(REF)applied to the first signal line 31. In the configuration illustrated inFIGS. 11 and 12, the voltage supply circuit 41 can reset the potentialof the charge accumulation node FD to a predetermined voltage level byswitching the voltage applied to the first signal line 31 serving as thereference voltage V_(REF) between multiple voltages through the changein the voltage of the first signal line 31.

As described above, the feedback loop is formed by turning on the resettransistor 22 and the address transistor 23. As seen with reference toFIG. 11, here, the gate of the reset transistor 22 of each of theimaging cells 10B belonging to the same row is connected to the commonreset signal line 38, and the gate of the address transistor 23 of eachof the imaging cells 10B belonging to the same row is connected to thecommon address signal line 39. That is, resetting of the potential ofthe charge accumulation node FD is executed on a row-by-row basis.

Thus, by switching the reference voltage applied to the first signalline 31 between resetting of the potential of the charge accumulationnode FD of each of the imaging cells 10B belonging to a row, andresetting of the potential of the charge accumulation node FD of each ofthe imaging cells 10B belonging to another row, the potential of thepixel electrode 61 after the reset can be made different from each otherbetween those rows. For instance, the voltage supply circuit 41 mayapply a voltage V_(H) to the first signal line 31 in the reset ofimaging cells 10B in the odd rows, and may apply a voltage V_(L) lowerthan the voltage V_(H) to the first signal line 31 in the reset of theimaging cells 10B in the even rows. In this case, the potentialdifference Φ between the pixel electrode 61 and the opposite electrode62 in the imaging cells 10B belonging to the odd rows at the start ofthe charge accumulation period is relatively smaller than the potentialdifference Φ in the imaging cells 10B belonging to the even rows. As aconsequence, the imaging cells 10B with a relatively low sensitivity andthe imaging cells 10B with a relatively high sensitivity are alternatelyarranged in the column direction, and the same state as in the exampledescribed with reference to FIG. 5A is achieved.

Like this, the reference voltage V_(REF) applied to the first signalline 31 may be switched between multiple voltages with differentabsolute values during a frame period. In the present description, the“frame period” indicates the period from the start of the chargeaccumulation period in the start row to the end of a second signal readperiod in the last row. It is to be noted that any voltage may be usedas the reference voltage V_(REF). However, it is advantageous to use avoltage lower than the power supply voltage AVDD from the viewpoint ofpower consumption reduction.

FIG. 13 illustrates another example of the circuit configuration of animaging device including the imaging cell 10B having the feedbackcircuit FC. The imaging device 100D illustrated in FIG. 13 has thevoltage supply circuit 41 including a voltage supply circuit 41 aconnected to a first signal line 31 a, and a voltage supply circuit 41 bconnected to a second signal line 31 b. At the time of operation of theimaging device 100D, the voltage supply circuit 41 a applies a referencevoltage V_(RST) 1 to the first signal line 31 a. The voltage supplycircuit 41 b applies a reference voltage V_(RST) 2 different from thereference voltage V_(RST) 1 in absolute value to the second signal line31 b. Each of the voltage supply circuits 41 a and 41 b may be separateindependent voltage supply circuit, or part of a single voltage supplycircuit.

Here, the non-inverting input terminal of the inverting amplifier 49 ofthe first column is connected to the first signal line 31 a, and thenon-inverting input terminal of the inverting amplifier 49 of the secondcolumn is connected to the second signal line 31 b. That is, the voltagesupply circuit 41 a supplies a reference voltage V_(REF) 1 to thenon-inverting input terminal of the inverting amplifier 49 of the firstcolumn via the first signal line 31. The voltage supply circuit 41 bsupplies a reference voltage V_(REF) 2 to the non-inverting inputterminal of the inverting amplifier 49 of the second column via thesecond signal line 31 b.

Similarly to the instance described with reference to FIG. 11, also inthis example, the voltage level of the pixel electrode 61 that gives alevel of image signal at a dark time is dependent on and determined bythe reference voltage V_(REF) applied to the non-inverting inputterminal of the inverting amplifier 49 disposed in each column. That is,in this example, the potential of the pixel electrode 61 after the resetis different between the imaging cells 10B belonging to the first columnand the imaging cells 10B belonging to the second column. In short, astate where the imaging cells 10 with different sensitivities arearranged column by column is achieved.

Like this, the reference voltage V_(REF) supplied to the invertingamplifier is switched between multiple voltages in a frame period, andthe reference voltage V_(REF) supplied to the inverting amplifier ismade different every multiple columns in the imaging cells 10B, therebymaking it possible to change the sensitivity of the imaging cell 10B ona row-by-row basis or column-by-column basis. For instance, the sourceof the reset transistor 22 of each of the imaging cells of the oddcolumns may be connected to the first signal line 31 a, and the sourceof the reset transistor 22 of each of the imaging cells of the evencolumns may be connected to the second signal line 31 b. In thissituation, when the reset voltage V_(RST) with different absolute valuesis applied to the first signal line 31 a and the second signal line 31b, the sensitivity can be made different between the imaging cell of theodd columns and the imaging cell of the even columns. Like this, thevoltage supply circuit 41 may supply the reset voltage V_(RST) withdifferent absolute values to imaging cells in part of multiple imagingcells, and other part of multiple imaging cells.

Embodiment 2

Instead of making the potential of the pixel electrode 61 immediatelybefore the start of accumulation of signal charges different between themultiple imaging cells 10 as in the Embodiment described above, thepotential of the opposite electrode 62 may be made different between themultiple imaging cells 10. For instance, the opposite electrode 62 isdivided into multiple portions, and the opposite electrode voltageV_(OPP) with different absolute values may be supplied to respectivedivided portions.

FIG. 14 illustrates an exemplary circuit configuration of an imagingcell of an imaging device according to Embodiment 2 of the presentdisclosure. FIG. 14 illustrates the circuit configurations of twoimaging cells 10Hx, 10Hy included in the pixel array PA.

The imaging device 100H illustrated in FIG. 14 has the imaging cells10Hx and 10Hy. A charge detector CDx of the imaging cell 10Hx and acharge detector CDy of the imaging cell 10Hy respectively include resetcircuits RSx1 and RSy1 that each include the reset transistor 22.However, here, the common reset voltage V_(RST) is applied to the sourceof the reset transistor 22 in the reset circuit RSx1 and the source ofthe reset transistor 22 in the reset circuit RSx2. In other words, here,the potential of the pixel electrode 61 of the imaging cell 10Hx and thepotential of the pixel electrode 61 of the imaging cell 10Hy after thereset are the same.

A photoelectric converter PCx of the imaging cell 10Hx has an oppositeelectrode 62 x, and a photoelectric converter PCy of the imaging cell10Hy has an opposite electrode 62 y electrically separated from theopposite electrode 62 x. As illustrated in FIG. 14, the oppositeelectrode 62 x and the opposite electrode 62 y are connected to a firstaccumulation control line 32 a and a second accumulation control line 32b, respectively. The first accumulation control line 32 a and the secondaccumulation control line 32 b are connected to the voltage supplycircuit 42.

In the configuration illustrated to FIG. 14, the voltage supply circuit42 includes voltage supply circuits 42 a and 42 b. Here, the firstaccumulation control line 32 a and the second accumulation control line32 b are connected to the voltage supply circuits 42 a and 42 b,respectively. The voltage supply circuits 42 a and 42 b supply a firstopposite electrode voltage V_(OPP) 1 and a second opposite electrodevoltage V_(OPP) 2 to the first accumulation control line 32 a and thesecond accumulation control line 32 b, respectively. That is, in thisexample, the imaging device 100H is configured to allow differentopposite electrode voltages to be independently applied to the oppositeelectrode 62 x connected to the first accumulation control line 32 a,and the opposite electrode 62 y connected to the second accumulationcontrol line 32 b. The voltage supply circuits 42 a and 42 b may beseparate independent voltage supply circuits, or may be part of a singlevoltage supply circuit.

At the time of operation of the imaging device 100H, each of theopposite electrode voltage V_(OPP) 1 and the opposite electrode voltageV_(OPP) 2 may be fixed to a constant value, or may repeat periodical orquasi-periodical change. For instance, in the charge accumulation periodof the imaging cell 10Hx, the opposite electrode voltage V_(OPP) 1,which is different from the opposite electrode voltage V_(OPP) 2 inabsolute value, may be supplied to the first accumulation control line32 a, the opposite electrode voltage V_(OPP) 2 being supplied to thesecond accumulation control line 32 b in the charge accumulation periodof the imaging cell 10Hy belonging to the same row as the row of theimaging cell 10Hx. The opposite electrode voltage applied to theopposite electrode in the charge accumulation is made different betweenthe imaging cell 10Hx and the imaging cell 10Hy, and thus the potentialof the opposite electrode 62 x of the imaging cell 10Hx, and thepotential of the opposite electrode 62 y of the imaging cell 10Hy can bemade different in the charge accumulation. When a common reset voltageis used as in this example, the bias voltage applied to thephotoelectric conversion structure 64 in the charge accumulation can bemade different between the imaging cell 10Hx and the imaging cell 10Hy.Consequently, the sensitivity of the imaging cell 10Hx and thesensitivity of the imaging cell 10Hy can be made different.

In this manner, separation of the opposite electrode 62 between theimaging cell 10Hx and the imaging cell 10Hy allows the oppositeelectrode voltages with different absolute values to be independentlyapplied to the opposite electrode 62 x of the imaging cell 10Hx and theopposite electrode 62 y of the imaging cell 10Hy. Similarly toEmbodiment 1, the sensitivity of the imaging cell can be made different,for instance, on a row-by-row basis, a column-by-column basis, orimaging cell-by-imaging cell basis by independently applying theopposite electrode voltages with different absolute values to theopposite electrode 62 x and the opposite electrode 62 y.

For instance, by applying photolithography, the opposite electrode 62 xof the imaging cell 10Hx and the opposite electrode 62 y of the imagingcell 10Hy can be formed with spatially separated, and these oppositeelectrodes can be electrically separated. For instance, multipleopposite electrodes may be formed in which the imaging cells arespatially separated column by column. In this case, multiplestrip-shaped opposite electrodes each extending in the column directionare arranged in the row direction, and the first accumulation controlline 32 a and the second accumulation control line 32 b may bealternately connected to these multiple opposite electrodes.Specifically, the imaging cells 10Hx and 10Hy are disposed in, forinstance, the odd columns and the even columns of the pixel array PA,respectively, and different opposite electrode voltages may be appliedto the odd columns and the even columns of the pixel array PA. In thiscase, an output, in which an image signal from an imaging cell with acertain sensitivity, and an image signal from an imaging cell with arelatively high sensitivity are interleaved column by column, isobtained. Alternatively, the opposite electrodes may be electricallyseparated row by row in the multiple imaging cells. In this case,multiple strip-shaped opposite electrodes each extending in the rowdirection are arranged in the column direction, and the firstaccumulation control line 32 a and the second accumulation control line32 b may be alternately connected to these multiple opposite electrodes.The latter is more advantageous than the former from the viewpoint ofreduction in the number of wires per row.

In the latter case, specifically, when the opposite electrodes areelectrically separated row by row in the multiple imaging cells, andmultiple opposite strip-shaped electrodes each extending in the rowdirection are formed, the imaging cells 10Hx and 10Hy are adjacent toeach other in the column direction. Therefore, in this case, the starttiming of the charge accumulation period of the imaging cell 10Hx doesnot match the start timing of the charge accumulation period of theimaging cell 10Hy. For instance, when a rolling shutter operation isapplied, the start timing of the charge accumulation period of theimaging cell 10Hx belonging to a certain row may not match the starttiming of the charge accumulation period of the imaging cell 10Hxbelonging to another row. However, for instance, the vertical signalline 34 is independently connected to the imaging cell 10Hx and theimaging cell 10Hy that are adjacent in the column direction, and thusthe start timings of the charge accumulation periods between theseimaging cells can be matched.

Needless to say, the opposite electrode 62 may be separated and providedfor each imaging cell. The opposite electrode 62 may be separated andformed for each imaging cell by patterning, and an accumulation controlline may be separately connected to the opposite electrode 62 of eachimaging cell. Thus, the potential difference Φ between the pixelelectrode 61 and the opposite electrode 62 can be made different on animaging cell-by-imaging cell basis.

The voltage supply circuit 41 may be configured to switch betweenmultiple voltages with different absolute values and to allow a voltageto be applied to the accumulation control line. For instance, theopposite electrode voltages V_(OPP) 1 and V_(OPP) 2 to be supplied tothe first accumulation control line 32 a and the second accumulationcontrol line 32 b, respectively in a period other than the chargeaccumulation period may be the same. In a period other than the chargeaccumulation period (for instance, a period for reset), an oppositeelectrode voltage V_(OPP) substantially equivalent to the reset voltageV_(RST) may be applied in common to the first accumulation control line32 a and the second accumulation control line 32 b. Consequently, in theperiod, the first bias voltage V1 applied to the photoelectricconversion structure 64 of the imaging cell 10Hx, and the second biasvoltage V2 applied to the photoelectric conversion structure 64 of theimaging cell 10Hy can be a value near 0 V. As described above, a statewith sensitivity of nearly zero can be achieved by making the potentialdifference Φ nearly 0 V, the potential difference Φ being applied acrossa pair of electrodes by which the photoelectric conversion structure isinterposed. In other words, a state with a shutter closed can beelectrical control.

For the configuration illustrated to FIG. 14, Embodiment 1 and/oranother example described later may be combined. For instance, in theconfiguration described with reference to FIG. 1, the oppositeelectrodes may be electrically separated row by row in the multipleimaging cells 10A. In this case, multiple strip-shaped oppositeelectrodes each extending in the column direction are formed. The firstaccumulation control line 32 a and the second accumulation control line32 b may be alternately connected to the multiple opposite electrodes. Acase is assumed in which an operation of applying different resetvoltages V_(RST) to the multiple imaging cells 10A row by row is used asillustrated in FIG. 14. In a period other than the charge accumulationperiod, an opposite electrode voltage V_(OPP), which causes thepotential difference Φ between the pixel electrode 61 and the oppositeelectrode 62 to assume 0 V, may be applied to each of the oppositeelectrode 62 of the imaging cells 10A in the odd rows, and the oppositeelectrode 62 of the imaging cells 10A in the even rows. With such anoperation, a shutter period in which charges are not substantially movedbetween the pixel electrode 61 and the photoelectric conversionstructures 64 can be provided between a frame period and the subsequentframe period.

Embodiment 3

FIG. 15 illustrates an exemplary circuit configuration of an imagingdevice according to Embodiment 3 of the present disclosure. In contrastto the above-described imaging device 100A, an imaging device 100Cillustrated in FIG. 15 has imaging cells 100 instead of the imagingcells 10A.

Each of the imaging cell 100 has a capacitor 25 in which one of theelectrodes is connected to the charge accumulation node FD. In thisinstance, the source of reset transistor 22 is connected to a resetvoltage line 37 r that supplies a predetermined reset voltage V_(RST).The first signal line 31 is connected to the other electrode of thecapacitor 25. In the configuration illustrated to FIG. 15, at the timeof operation of the imaging device 100C, the voltage supply circuit 41applies an offset voltage V_(TP) to the first signal line 31.

FIG. 16 illustrates an overview of the circuit configuration of oneimaging cell 100C in the pixel array PA. As schematically illustrated inFIG. 16, a charge detector CD3 of the imaging cell 100 includes acapacitive circuit CC1 connected between the pixel electrode 61 and thefirst signal line 31. In the configuration illustrated to FIG. 16, thecapacitive circuit CC1 has the above-described capacitor 25, and thefirst signal line 31 is electrically coupled to the charge accumulationnode FD via the capacitor 25.

As illustrated in FIG. 16, the first signal line 31 and the pixelelectrode 61 are electrically coupled to each other via the capacitor25. With such a configuration also, the potential of the pixel electrode61 can be changed by switching a voltage applied to the first signalline 31. For instance, it is assumed that after the potential of thecharge accumulation node FD is reset, the reset transistor 22 is turnedoff, and accumulation of signal charges is started by switching theoffset voltage V_(TP) from the low-level voltage V_(L) to the high-levelvoltage V_(H). In this case, when the offset voltage V_(TP) is changedfrom the voltage V_(L) to the voltage V_(H), the voltage of the chargeaccumulation node FD changes from voltage V_(RST) immediately after thereset, due to the electrical coupling between the first signal line 31and the charge accumulation node FD via the capacitor 25. The amount ofchange in the voltage of charge accumulation node FD at this point isdetermined as follows.

Let C_(FD) be the capacitive value of the charge accumulation node, C1be the capacitive value of the capacitor 25, and V_(RST) be the voltageof the charge accumulation node FD immediately after the reset. In thissituation, the charge quantity Q accumulated in the charge accumulationnode FD immediately before the switching of the offset voltage V_(TP)can be expressed by Q=C_(FD)V_(RST)−C1(V_(L)−V_(RST)). On the otherhand, let V_(FD) be the voltage of the charge accumulation node FDimmediately after the switching of the offset voltage V_(TP) to thevoltage V_(H), then Q=C_(FD)V_(FD)−C1(V_(H)−V_(FD)) holds. When anequation is formed by equating these right-hand sides because of thecondition of charge neutrality, and the equation is solved for V_(FD),V_(FD)=(C1/(C1+C_(FD)))(V_(H)−V_(L))+V_(RST) is obtained. Thus, theamount of change in the voltage of the charge accumulation node FD byswitching the offset voltage V_(TP) from the voltage V_(L) to thevoltage V_(H) is expressed by the following Expression (1).(C1/(C1+C_(FD)))(V_(H)−V_(L))  (1)

When a capacitive value C1 of the capacitor is sufficiently large withrespect to C_(FD), from the above-mentioned Expression (1), Expression(1) approximately gives (V_(H)−V_(L)). Thus, it is found that thevoltage V_(FD) of the charge accumulation node FD is changed by theswitching of the offset voltage V_(TP) by an amount approximately equalto (V_(H)−V_(L)) which is the change in the offset voltage V_(TP).

With the electrical coupling via the capacitor, the change in thevoltage applied to the first signal line 31 is accompanied by theabove-described changed in the potential of the pixel electrode 61. Whenthe voltage applied to the first signal line 31 is returned to theoriginal voltage, the potential of the pixel electrode 61 is alsoreturned to the voltage before the change of the voltage applied to thefirst signal line 31. That is, it is possible to change the potential ofthe pixel electrode 61 by changing the voltage applied to the firstsignal line 31 without affecting the charge quantity accumulated in thecharge accumulation node FD. Thus, for instance, in the chargeaccumulation period in a frame period, an offset voltage V_(TP), whichis higher than in other periods, may be applied to the first signal line31. Thus, in the charge accumulation period out of the period excludinga shutter period, it is possible to temporarily increase the potentialof the pixel electrode 61. Thus, the potential difference Φ between thepixel electrode 61 and the opposite electrode 62 can be selectivelyreduced in the charge accumulation period, and the sensitivity of theimaging cell 100 can be changed.

With the electrical coupling via the capacitor, the voltage applied tothe first signal line 31 can be returned to the original voltage levelin a signal read period. Therefore, even when a relatively high voltageis used as the offset voltage V_(TP) applied to the first signal line 31in the charge accumulation period, a signal can be read from eachimaging cell without changing the power supply voltage, and thus theflexibility of design of the imaging device is improved. In short, ahigher power supply voltage is not necessary in a read period.

The capacitor 25 may have a metal-insulator-semiconductor (MIS)structure. The capacitor 25 may have a metal-insulator-metal (MIM)structure, for instance, in the interlayer insulation layer 52. The MIMstructure refers to a structure in which a dielectric substance isinterposed between two electrodes which are composed of a metal or ametal compound. For instance, SiO₂, Al₂O₃, SiN, HfO₂, ZrO₂ may be usedas the dielectric substance interposed between two electrodes.Alternatively, the capacitor 25 may have a structure in which aparasitic capacitance between wires is intentionally utilized. In thiscase, the capacitive value of the parasitic capacitance between thefirst signal line 31 and the charge accumulation node FD has asignificantly large value compared with the capacitive value of thecharge accumulation node FD. The capacitor 25 may include two or morecapacitors.

FIG. 17 illustrates a variation of the circuit configuration of theimaging cell. An imaging cell 10D illustrated in FIG. 17 has thecapacitive circuit CC1 including the capacitor 25, and the feedbackcircuit FC described with reference to FIG. 12. The electrical couplingbetween the first signal line 31 and the pixel electrode 61 via thecapacitor 25 allows the potential of the pixel electrode 61 to betemporarily increased (or decreased) in the charge accumulation periodout of the period excluding a shutter period, for instance.

Embodiment 4

FIG. 18 illustrates an exemplary circuit configuration of an imagingcell of an imaging device according to Embodiment 4 of the presentdisclosure. The point of difference between an imaging cell 10Eillustrated in FIG. 18, and the imaging cell 10D described withreference to FIG. 17 is that the photoelectric conversion structure 64of the photoelectric converter PC of the imaging cell 10E includes amultilayer structure having the first photoelectric conversion layer 64a and the second photoelectric conversion layer 64 b.

The first photoelectric conversion layer 64 a and the secondphotoelectric conversion layer 64 b include the first material and thesecond material, respectively. A photoelectric conversion structurehaving sensitivity of a desired wavelength range can be implemented byusing appropriate materials as the first material and the secondmaterial according to a wavelength range to be detected. For instance, amaterial having a high absorption coefficient in the visible range and amaterial having a high absorption coefficient in the infrared range maybe used as the first material and the second material, respectively. Anelectron-donating material is typically selected as the first materialand the second material. In the present description, the infrared rangerefers to a wavelength range of approximately 750 nm or greater, andparticularly, near-infrared range refers to a wavelength range of 750 nmor greater and less than 2500 nm, for instance.

For instance, the impedance of the first photoelectric conversion layer64 a is greater than the impedance of the second photoelectricconversion layer 64 b. Or, the ionization potential of the firstmaterial is greater than the ionization potential of the second materialby 0.2 eV or more. The impedances of the first photoelectric conversionlayer 64 a and the second photoelectric conversion layer 64 b maysatisfy the above-mentioned relationship, or the ionization potentialsof the first material and the second material may satisfy theabove-mentioned relationship. In this case, the spectral sensitivitycharacteristic of the photoelectric conversion structure can be changedby changing the potential difference Φ between the pixel electrode 61and the opposite electrode 62.

For instance, by changing the potential difference Φ between the pixelelectrode 61 and the opposite electrode 62, it is possible to switchbetween a state where the imaging cell 10E selectively has sensitivityin a wavelength range of visible light, and a state where the imagingcell 10E selectively has sensitivity in a wavelength range of infraredlight in addition to a wavelength range of visible light. The details ofphotoelectric conversion structure, which allows the spectralsensitivity characteristic to be modulated according to potentialdifference Φ, will be described later.

More diverse functions can be achieved by adopting a photoelectricconversion structure that includes a multilayer structure having thefirst photoelectric conversion layer 64 a and the second photoelectricconversion layer 64 b. When a photoelectric conversion structureincluding a multilayer structure having the first photoelectricconversion layer 64 a and the second photoelectric conversion layer 64 bis adopted, it is advantageous if the above-described voltage supplycircuit 41 is configured to switch between three voltages and to allow avoltage to be applied.

FIG. 19 illustrates an instance of the operation of the imaging deviceto which the imaging cell 10E illustrated in FIG. 18 is applied. Theinstance illustrated in FIG. 19 is an application instance utilizing arolling shutter operation. In the instances described so far, asubstantially constant voltage is applied as the opposite electrodevoltage V_(OPP). However, at the time of operation of the imagingdevice, the opposite electrode voltage V_(OPP) does not have to be fixedat a certain level. Here, it is assumed that the voltage supply circuit42 connected to the accumulation control line 32 is configured to switchbetween multiple voltages with different absolute values and to allow avoltage to be applied. The voltage supply circuit 42 is configured toswitch between multiple voltages with different absolute values and toallow a voltage to be applied, and thus a circuit having a simplerconfiguration can used as the voltage supply circuit 41.

In this instance, in the first frame period, the voltage supply circuit42 applies a certain voltage V₂ to the accumulation control line 32 asthe opposite electrode voltage V_(OPP). In the subsequent frame period,the voltage supply circuit 42 applies another voltage V₃ different fromthe voltage V₂ to the accumulation control line 32 as the oppositeelectrode voltage V_(OPP). In other words, between the two frame periodsillustrated in FIG. 19, the voltage supply circuit 42 switches thevoltage applied to the accumulation control line 32 connected to theopposite electrode 62. Here, it is assumed that the relationship ofvoltage V₃<voltage V₂ holds between the voltage V₂ and the voltage V₃.The voltage V₂ is a voltage such that for instance, when the high-levelvoltage V_(H) is applied to the first signal line 31, the potentialdifference between the pixel electrode 61 and the opposite electrode 62is 0 V.

In the instance illustrated in FIG. 19, the voltage supply circuit 41applies one of the high-level voltage V_(H) and the low level voltageV_(L) to the first signal line 31 as the offset voltage V_(TP). Whenattention is focused on the charge accumulation period included in thefirst frame period, the absolute value of the potential difference Φ ishigh to some extent, and the imaging cell 10E has sensitivity in thewavelength ranges of visible light and infrared light. “|Φ|: Lrg” inFIG. 19 indicates that the potential difference Φ is relatively high.

When attention is focused on the charge accumulation period included inthe subsequent frame period, the absolute value of potential differenceΦ is reduced due to the relationship of voltage V₃<voltage V₂, and theimaging cell 10E selectively has sensitivity in the wavelength range ofvisible light. “|Φ|: Mid” in FIG. 19 indicates that the absolute valueof potential difference Φ is relatively small as compared with a statewhere the voltage V₂ is applied to the accumulation control line 32. Inthis manner, the voltage applied to the opposite electrode 62 is changedbetween different frames. Thus, the voltage applied to the first signalline 31 is used common to the charge accumulation periods of differentframes, and an image signal based on visible light and infrared lightcan be obtained in a frame period, and an image signal based on visiblelight can be obtained in another frame period.

In the instance illustrated, between the first frame period and thesubsequent frame period, the high-level voltage V_(H) is applied to thefirst signal line 31. In a state where the voltage V₂ is applied to theaccumulation control line 32 as the opposite electrode voltage V_(OPP),the potential difference Φ can be made closer to 0, and the sensitivityof the imaging cell 10E can be made substantially 0 by applying thehigh-level voltage V_(H) to the first signal line 31 as the offsetvoltage V_(TP). However, when the opposite electrode voltage V_(OPP) isswitched to the voltage V₃, and the absolute value of potentialdifference Φ is increased, and accumulation or discharge of signalcharges may occur. The period indicated by a double-headed arrow P0 inFIG. 19 is a period in which the sensitivity of the imaging cells 10Ebelonging to the second row is substantially 0, and the period indicatedby a double-headed arrow P1 is a period in which the sensitivity of theimaging cells 10E belonging to the second row is not substantially 0.Therefore, in the instance illustrated in FIG. 19, before the start of acharge accumulation period, an electronic shutter (indicated by therectangle RT1) for discharging charges from a charge accumulation regionis operated again.

The offset voltage V_(TP) applied to the first signal line 31 may beswitched between multiple voltages with different absolute values in thecharge accumulation period according to a frame. With this control, animage signal based on visible light and infrared light can be obtainedin a frame period, and an image signal based on visible light can beobtained in another frame period.

In the instance illustrated in FIG. 19, the opposite electrode voltageV_(OPP) is switched between frame periods, however, similarly to theinstances described so far, the opposite electrode voltage V_(OPP) maybe fixed to a constant value. The opposite electrode voltage V_(OPP) isfixed to constant value, and the offset voltage V_(TP) applied to thefirst signal line 31 may be switched between the voltages V_(H) andV_(L) between frame periods. Also with this control, similarly to theinstance described with reference to FIG. 19, an image signal based onvisible light and infrared light can be obtained in a frame period, andan image signal based on visible light can be obtained in another frameperiod. It is to be noted that in this case, a period in which theoffset voltage V_(TP) is switched to voltage V_(H) and an electronicshutter (indicated by rectangle the RT1) period between two consecutivecharge accumulation periods are omissible.

Embodiment 5

FIG. 20 illustrates an exemplary circuit configuration of a pixel arrayof an imaging device according to Embodiment 5 of the presentdisclosure. FIG. 20 schematically illustrates two adjacent imaging cells10Ex and 10Ey in the row direction among multiple imaging cells includedin the pixel array PA. The pixel array PA of the imaging deviceaccording to Embodiment 5 has a repetitive structure in which a unitsuch as a cell pair 10Ep including the two imaging cells 10Ex and 10Eyis repeated.

In FIG. 20, the circuit configuration of the imaging cells 10Ex and 10Eyis essentially the same as the circuit configuration of the imaging cell10E described with reference to FIG. 18. However, a capacitor 25 x inthe capacitive circuit CC1 of the imaging cell 10Ex and a capacitor 25 yin the capacitive circuit CC1 of the imaging cell 10Ey have differentcapacitive values.

In the configuration illustrated to FIG. 20, the capacitor 25 x of thecapacitive circuit CC1 of the imaging cell 10Ex and the capacitor 25 yof the capacitive circuit CC2 of the imaging cell 10Ey are bothconnected to the first same signal line 31. Therefore, change in thepotential of the side of the electrode, connected to the first signalline 31 is in common with the capacitor 25 x and the capacitor 25 y.However, here, the capacitive value of the capacitor 25 x of the imagingcell 10Ex and the capacitive value of the capacitor 25 y of the imagingcell 10Ey are different from each other. Therefore, even though thechange in the offset voltage V_(TP) is in common, the change in thevoltage of the charge accumulation node is different between the imagingcells 10Ex and 10Ey. Hereinafter, this point will be described.

First, it is assumed that in a reset period and a signal read period,the low-level voltage V_(L) is applied to the first signal line 31 asthe offset voltage V_(TP), and also in a charge accumulation period, thelow-level voltage V_(L) is applied to the first signal line 31. Here,the opposite electrode voltage V_(OPP) is set to a constant value.Therefore, in the time of operation of the imaging device, the potential(potential of point A illustrated in FIG. 20) of the opposite electrode62 of the imaging cell 10Ex is equal to the potential (potential ofpoint B illustrated in FIG. 20) of the opposite electrode 62 of theimaging cell 10Ey.

Before photographing, the potentials of the charge accumulation node FDxof the imaging cell 10Ex and the charge accumulation node FDy of theimaging cell 10Ey are reset. As already described, the voltage level ofthe pixel electrode 61, that gives a level of image signal at a darktime is dependent on and determined by the reference voltage V_(REF)applied to the inverting amplifier 49. In this instance, the referencevoltage V_(REF) 1 is applied to the non-inverting input terminal of theinverting amplifier 49 of the imaging cell 10Ex, and the referencevoltage V_(REF) 2 is applied to the non-inverting input terminal of theinverting amplifier 49 of the imaging cell 10Ey. The reference voltagesV_(REF) 1 and V_(REF) 2 may be the same or may be different from eachother. For instance, it is also possible to equalize the potential(potential of point C illustrated in FIG. 20) of the charge accumulationnode FDx after the reset, and the potential (potential of point Dillustrated in FIG. 20) of the charge accumulation node FDy after thereset by adjusting the reference voltages V_(REF) 1 and V_(REF) 2. Here,for the sake of simplicity, it is assumed that the voltages of thecharge accumulation node FDx and the charge accumulation node FDy afterthe reset are the same voltage Vr.

In the charge accumulation period, the low-level voltage V_(L) isapplied to the 1st signal line 31. Therefore, in the charge accumulationperiod, the potential difference Φ between the pixel electrode 61 andthe opposite electrode 62 is relatively high. Thus, in this instance,each of the imaging cells 10Ex and 10Ey has sensitivity to thewavelength range of infrared light in addition to the wavelength rangeof visible light, for instance.

Next, it is assumed that in a reset period and a signal read period, thelow-level voltage V_(L) is applied to the first signal line 31 as theoffset voltage V_(TP), and in the charge accumulation period, anintermediate level voltage V_(M) is applied to the first signal line 31.Let Cx and Cy be the capacitive values of the capacitors 25 x and 25 y,respectively, then the change in the voltage of the charge accumulationnodes FDx and FDy by switching of the offset voltage V_(TP) is expressedby the following Expressions (2) and (3) derived from Expression (1):(Cx/(Cx+C_(FD)))(V_(M)−V_(L))  (2)(Cy/(Cy+C_(FD)))(V_(M)−V_(L))  (3)

Here, assume that the capacitive value Cx of the capacitor 25 x of theimaging cell 10Ex is sufficiently large with respect to C_(FD), thechange in the charge accumulation node FDx by switching of the offsetvoltage V_(TP) is approximately equal to (V_(M)−V_(L)). The voltageapplied to the photoelectric conversion structure 64 is the differencebetween the potential of the opposite electrode voltage V_(OPP) and thepotential of the charge accumulation node FD. Thus, in the imaging cell10Ex in which the capacitive value Cx of the capacitor 25 x issufficiently larger than the capacitive value C_(FD) of the chargeaccumulation node FD, the potential difference Φ applied to thephotoelectric conversion structure can be reduced to approximately theamount of change ΔV_(TP)=(V_(M)−V_(L)) in the offset voltage applied tothe first signal line 31.

In contrast, when the capacitive value Cy of the capacitor 25 y of theimaging cell 10Ey is smaller than the capacitive value Cx of thecapacitor 25 x, and is approximately equal to the C_(FD), for instance,the amount of change in the voltage of the charge accumulation node FDyis approximately only half of (V_(M)−V_(L)). When the capacitive valueCy is sufficiently smaller than the C_(FD), it is found from Expression(3) that even if the offset voltage V_(TP) is changed, the voltage ofthe charge accumulation node FDy hardly changes.

Like this, with the configuration in which the first signal line 31 iselectrically coupled to the pixel electrode 61 via the capacitor, bychanging the capacitive value of the capacitor between imaging cells,the change in the potential difference Φ between the pixel electrode 61and the opposite electrode 62 can be made different between two imagingcells while the offset voltage V_(TP) applied to the first signal line31 is used in common. It is to be noted that reducing the capacitivevalue of the capacitor interposed between the first signal line 31 andthe pixel electrode 61 is advantageous for miniaturization of pixelsize. On the other hand, interposing a capacitor having a largercapacitive value between the first signal line 31 and the pixelelectrode 61 allows the potential of the charge accumulation node FD tobe changed by switching the voltage applied to the first signal line 31without unnecessarily increasing the amount of change in the voltageapplied to the first signal line 31.

Also, with this configuration, the change in the potential difference Φbetween the pixel electrode 61 and the opposite electrode 62 can be madedifferent between multiple imaging cells with the complexity of theconfiguration and wiring of the voltage supply circuit being avoided.Therefore, it is possible to achieve a state in which the photoelectricconverter PCx of the imaging cell 10Ex has sensitivity in the wavelengthrange of visible light, and the photoelectric converter PCy of theimaging cell 10Ey also has sensitivity to the wavelength range ofinfrared light in addition to the wavelength range of visible light byswitching the offset voltage V_(TP) while the offset voltage V_(TP)applied to the first signal line 31 is used in common, for instance.

For instance, it is assumed that the pixel array PA has a repetitivestructure in which a unit formed by the cell pair 10Ep including the twoimaging cells 10Ex and 10Ey is repeated, and the imaging cells 10Ex and10Ey are alternately arranged in the row direction and the columndirection. At this point, when the offset voltage V_(TP) applied to thefirst signal line 31 is changed from a low-level to a high-level, forinstance, the potential difference Φx applied to the photoelectricconversion structure 64 of the imaging cell 10Ex is reduced, whereas thepotential difference Φy applied to the photoelectric conversionstructure 64 of the imaging cell 10Ey hardly changes. In this case, dueto the reduction of the potential difference Φx applied to photoelectricconversion structure 64, the photoelectric converter PCx of the imagingcell 10Ex substantially loses sensitivity to infrared light, and theimaging cell 10Ex selectively has sensitivity to the wavelength range ofvisible light. In contrast, the imaging cell 10Ey still has sensitivityto the wavelength range of infrared light in addition to the wavelengthrange of visible light. Therefore, similarly to the instance describedwith reference to FIG. 7, it is possible to achieve a state in which theimaging cells having different sensitivities (sensitivities to infraredlight in this instance) are alternately arranged in the row directionand the column direction. In other words, the imaging cells withdifferent spectral sensitivity characteristics can be mixed in the pixelarray PA while the offset voltage V_(TP) applied to the first signalline 31 is used in common. Therefore, it is possible to collectivelyobtain image signals based on light with different wavelength ranges.

According to Embodiments of the present disclosure, it is possible toform an image based on visible light and infrared light from an imagesignal obtained by one of two imaging cells with different potentialdifferences Φ to be applied to the photoelectric conversion structure 64in the charge accumulation period. In addition, it is possible to forman image based on visible light from an image signal obtained by theother of the two imaging cells. Furthermore, it is also possible to forman image based on infrared light by calculating the difference betweenthe levels of output signals of these imaging cells. Each of theseimages is formed from an image signal based on the amount of signalcharges accumulated in the same charge accumulation period, and thussynchronization is guaranteed. Therefore, even when a high-speed movingobject is photographed, blur does not occur in the image based on thedifference. This point is different from the case where the spectralsensitivity characteristic of the imaging cell is changed between twoframes, and multiple image signals based on light with differentwavelength ranges are successively obtained.

In this manner, with configuration illustrated in FIG. 20, an imagebased on visible light can be formed from the image signal obtained bythe imaging cell 10Ey, and an image based on visible light and infraredlight can be formed from the image signal obtained by the imaging cell10Ex, for instance. Also, it is possible to form an image based oninfrared light by calculating the difference between the level of theoutput signal of imaging cell 10Ex and the level of the output signal ofimaging cell 10Ey. In short, a state similar to the control stateillustrated in FIG. 7 can be achieved by a simpler configuration. Inparticular, when the pixel array PA is formed as a repetitive structurein which the cell pair 10Ep including the imaging cell 10Ex and 10Eyhaving capacitors with different capacitive values is repeated, imagingcells with different spectral sensitivity characteristics can bearranged uniformly in the pixel array PA, and thus it is advantageousfor color resolution.

As is seen from Expressions (2) and (3), the above-mentioned effect isachieved when the ratio of the capacitive value of the capacitor thatelectrically couples the first signal line 31 and the pixel electrode 61with respect to the capacitive value of the charge accumulation node isdifferent between the imaging cells. Therefore, it is not required thatthe capacitive value of the capacitor that electrically couples thefirst signal line 31 and the pixel electrode 61 is made differentbetween adjacent imaging cells. For instance, the capacitive value ofthe capacitor that electrically couples the first signal line 31 and thepixel electrode 61 may be made common between the multiple imagingcells, and the capacitive value of the charge accumulation node may bemade different between the multiple imaging cells.

In the configuration illustrated to FIG. 20, the photoelectric converterPCy of the imaging cell 10Ey has a larger electrode surface area thanthe photoelectric converter PCx of the imaging cell 10Ex has. Thephotoelectric converter itself has a capacitive, and in the instanceillustrated in FIG. 20, the photoelectric converter PCy of the imagingcell 10Ey has a larger capacitive value for the entire chargeaccumulation region than the photoelectric converter PCx of the imagingcell 10Ex has. Therefore, it can be said that the imaging cell 10Ey isless affected by switching of the voltage applied to the first signalline 31. Needless to say, the electrode surface area of thephotoelectric converter PCx and the electrode surface area of thephotoelectric converter PCy may be equal.

The photoelectric converter PCy of the imaging cell 10Ey has arelatively large electrode surface area, and the capacitive value of thecapacitor 25 y is relatively small. Therefore, it can be said that theimaging cell 10Ey has a high conversion gain, and a high sensitivity. Incontrast, the photoelectric converter PCx of the imaging cell 10Ex has asmaller electrode surface area than that of the photoelectric converterPCy, and the capacitor 25 x has a larger capacitive value than that ofthe capacitor 25 y. Therefore, the imaging cell 10Ex has a relativelylow conversion gain, and it is advantageous for photographing under highillumination. With this configuration, when a photoelectric conversionstructure not including a multilayer structure having the firstphotoelectric conversion layer 64 a and the second photoelectricconversion layer 64 b is applied as in the photoelectric conversionstructure 64 in Embodiments 1 to 3, even for a scene with a largecontrast ratio, an image with no blown out highlights and blocked upshadows can be formed by composing the image data obtained by these twoimaging cells. Such image formation is called “high dynamic rangeimaging”. Like this, according to Embodiments of the present disclosure,it is also possible to obtain image data for high dynamic range imagingwithout performing photographing twice or more. In other words,photographing in a wide dynamic range is possible.

Embodiment 6

FIG. 21 illustrates an exemplary circuit configuration of a pixel arrayof an imaging device according to Embodiment 6 of the presentdisclosure. In contrast to the cell pair 10Ep described with referenceto FIG. 20, a cell pair 10Gp illustrated in FIG. 21 has an imaging cell10Gy instead of the imaging cell 10Ey.

A reset circuit RS3 of the imaging cell 10Gy illustrated on the rightside of FIG. 21 has a feedback circuit FCy including a reset transistor22 y, an inverting amplifier 49, and a feedback transistor 27. Thefeedback transistor 27 is connected between the source of the resettransistor 22 and an output terminal of the inverting amplifier 49. Acommon signal line may be connected to the gate of the feedbacktransistor 27 and the gate of the reset transistor 22 x of the imagingcell 10Ex. In other words, the ON and OFF operations of the feedbacktransistor 27 can be same as the ON and OFF operations in the resettransistor 22 x of the imaging cell 10Ex.

The imaging cell 10Gy includes the capacitive circuit CC2 connectedbetween the pixel electrode 61 and the first signal line 31. Thecapacitive circuit CC1 of the imaging cell 10Ex has the capacitor 25 xconnected between the pixel electrode 61 and the first signal line 31,and the capacitive circuit CC2 of the imaging cell 10Gy further has asecond capacitor 26 y in addition to the capacitor 25 y connectedbetween the pixel electrode 61 and the first signal line 31. In thisinstance, the charge detector of the imaging cell 10Gy includes not onlythe impurity region 50 a (for instance, see FIG. 1), but also thecapacitors 25 y and 26 y in part.

One of the electrodes of the capacitor 26 y is connected to the pixelelectrode 61, and the other of the electrodes is connected to the sourceof the reset transistor 22 y. In short, the capacitor 26 y is connectedin parallel to the reset transistor 22 y. The capacitor 26 y has acapacitive value smaller than the capacitive value of the capacitor 25y. Accumulation of signal charges with the offset voltage V_(TP) changedis executed with the reset transistor 22 y OFF.

An increase in the synthetic capacity of the entire charge accumulationregion can be suppressed by connecting the capacitor 26 x to the chargeaccumulation node FDy via the capacitor 26 y. In other words, the effectof the change in the voltage applied to the first signal line 31 on thepotential difference Φ between the pixel electrode 61 and the oppositeelectrode 62 is reduced. As illustrates to FIG. 21, when the capacitor25 y is connected to the charge accumulation node FDy via the capacitor26 y, the capacitive value of the signal charges in the entireaccumulation region in the configuration is expressed by the following:(C_(FDy)+(Cy1Cy2)/(Cy1+Cy2)). C_(FDy), Cy1, and Cy2 in the Expressionabove indicate the capacitive value of the charge accumulation node FDy,the capacitive value of the capacitor 25 y, and the capacitive value ofthe capacitor 26 y, respectively. Here, when the capacitor 26 y has arelatively small capacitive value Cy2, and the capacitor 25 y has arelatively large capacitive value Cy1, the capacitive value of thesignal charges in the entire accumulation region is approximately(C_(FDy)+Cy2). That is, the increase in the capacitive value of thesignal charges in the entire accumulation region is small. Like this,the effect is achieved that the change in the potential of the chargeaccumulation node FDy with respect to the change in the offset voltageV_(TP) is changed by connecting the capacitor 25 y to the chargeaccumulation node FDy via the capacitor 26 y having a relatively smallcapacitive value.

For instance, assume that the offset voltage V_(TP) applied to the firstsignal line 31 is 0 V and the potentials of the charge accumulationnodes FDx and FDy are both 1 V immediately after the reset, then thereset transistors 22 x and 22 y, and the feedback transistor 27 are OFFstate. Here, assume that the offset voltage V_(TP) applied to the firstsignal line 31 is increased to 5 V, for instance, then the potential ofthe charge accumulation node FDx is increased to 6 V, for instance. Onthe other hand, the potential of the charge accumulation node FDyremains at 1 V, for instance.

Also, since the capacitive circuit CC2 includes the capacitor 26 y, theeffect of noise cancellation can be improved by suppressing the decreasein the conversion gain. Hereinafter, an overview of noise cancellationutilizing negative feedback will be described.

For instance, the reset of a signal charge after the charge accumulationperiod is executed as follows. First, a feedback loop is formed byturning on the reset transistor 22 y and the feedback transistor 27 withthe address transistor 23 on. The formation of a feedback loop causesnegative feedback of an output of the signal detection transistor 21.Due to the negative feedback of the output of the signal detectiontransistor 21, the potential of the charge accumulation node FDyconverges a potential such that the voltage of the vertical signal line34 is equalized to the V_(REF) 2.

Next, the reset transistor 22 y is turned off. kTC noise occurs byturning off the reset transistor 22 y. Therefore, the voltage of thecharge accumulation node FDy after the reset includes the kTC noise thataccompanies the turning off of the reset transistor 22 y. After theturning off of the reset transistor 22 y, cancellation of the kTC noiseis executed.

While the feedback transistor 27 is on, the formation of a feedback loopis maintained. Thus, the kTC noise generated by turning off the resettransistor 22 y is reduced to the magnitude of 1/(1+A), where A is thegain of the feedback circuit FCy. In this instance, the voltage of thevertical signal line 34 immediately before the turning off the resettransistor 22 y (immediately before the start of noise cancellation) isapproximately equal to the reference voltage V_(REF) 2 which is appliedto the positive-side input terminal of the inverting amplifier 49. ThekTC noise can be canceled in a relatively short time by setting thevoltage of the vertical signal line 34 at the start of noisecancellation to a level close to the reference voltage V_(REF) 2.

Next, the feedback transistor 27 is turned off. The kTC noise occursaccompanying the turning off of the feedback transistor 27. However, thesize of kTC noise added to the voltage of the charge accumulation nodeFDy due to the turning off of the feedback transistor 27 is(C_(FDy)/Cy1)^(1/2)×(Cy2/(Cy2+C_(FDy))) times greater than the size ofkTC noise when the feedback transistor 27 is directly connected to thecharge accumulation node FDy without providing the capacitor 25 y andthe capacitor 26 y in the imaging cell 10Gy (“x” in the Expressionindicates multiplication).

From the above Expression, it is seen that larger the capacitive valueCy1 of the capacitor 25 y, smaller the generated noise itself, andsmaller the capacitive value Cy2 of the capacitor 26 y, lower theattenuation rate. The kTC noise generated by turning off the feedbacktransistor 27 can be sufficiently reduced by setting the capacitivevalues Cy1 and Cy2 appropriately. After the feedback transistor 27 isturned off, a signal, in which the kTC noise has been canceled, is read.

The capacitor 25 y is connected to the charge accumulation node FDy viathe capacitor 26 y with the reset transistor 22 y and the feedbacktransistor 27 turned off. Here, it is assumed that the chargeaccumulation node FDy and the capacitor 25 y are directly connected, notvia the capacitor 26 y. In this case, the capacitive value of the signalcharges in the entire accumulation region when the capacitor 25 y isdirectly connected is (C_(FDy)+Cy1). That is, when the capacitor 25 yhas a relatively large capacitive value Cy1, the capacitive value of thesignal charges in the entire accumulation region also becomes large, anda high conversion gain (may be referred to a high S/N ratio) is notobtained. On the other hand, when the capacitor 25 y is connected to thecharge accumulation node FDy via the capacitor 26 y as illustrated inFIG. 21, and if the capacitive value Cy2 is relatively small and thecapacitive value Cy1 is relatively large, the capacitive value of thesignal charges in the entire accumulation region is (C_(FDy)+Cy2) asdescribed above. That is, the increase in the capacitive value of thesignal charges in the entire accumulation region is small, and thedecrease in the conversion gain is reduced.

FIG. 22 illustrates a variation of the pixel array of the imaging deviceaccording to Embodiment 6 of the present disclosure. As illustrated inFIG. 22, a cell pair 10Fp includes the above-described imaging cell 10Exand imaging cell 10Fy. The imaging cell 10Fy does not have a capacitorthat electrically couples the first signal line 31 to the pixelelectrode 61. Although a parasitic capacitance may be present betweenthe first signal line 31 and the charge accumulation node FDy, thecapacitive value of the parasitic capacitance is so small to benegligible compared with the capacitive value of the charge accumulationnode FDy. That is, the first signal line 31 has no intentionalelectrical coupling between the imaging cell 10Fy and itself.

As illustrated in FIG. 22, an imaging cell that does not have acapacitor that electrically couples the first signal line 31 to thepixel electrode 61 may be included in the pixel array PA intentionally.In other words, an imaging cell Fy, in which the spectral sensitivitycharacteristic is not changed by switching of the offset voltage V_(TP)applied to the first signal line 31, may be included in the pixel arrayPA. With this configuration, it is possible to selectively cause amodulation of the spectral sensitivity characteristic in an imaging cellin which the pixel electrode 61 is electrically coupled to the firstsignal line via a capacitor.

FIG. 23 illustrates an instance of the operation of the imaging deviceto which the imaging cells 10Ex and 10Gy illustrated in FIG. 21 areapplied. The instance illustrated in FIG. 23 is an application instanceutilizing a rolling shutter operation.

As illustrated in FIG. 23, the voltage supply circuit 41 applies ahigh-level voltage V_(H) to the first signal line 31 in each chargeaccumulation period denoted by rectangle EXP, and applies a low-levelvoltage V_(H) to the first signal line 31 in a period other than thecharge accumulation period. It is to be noted that in FIG. 23, thesignal read periods indicated by rectangles RD1, RD2, and the resetperiods indicated by rectangles RT2 in FIG. 4 are each represented by asingle rectangle RD/RT. It is to be noted that each of the periods forreset represented by rectangles RT1 and the periods for reset includedin periods represented by rectangles RD/RT in FIG. 23 includes a periodin which a feedback loop is formed.

Here, for the sake of simplicity, it is assumed that the voltages of thecharge accumulation node FDx and the charge accumulation node FDy afterthe reset are the same voltage Vr. When attention is focused on thecharge accumulation period of each row, at the start timing of thecharge accumulation period, the voltage supply circuit 41 switches theoffset voltage V_(TP) applied to the first signal line 31 from thelow-level voltage V_(L) which has been applied at the reset time to thehigh-level voltage V_(H). At this point, when the capacitive value Cx ofthe capacitor 25 x of the imaging cell 10Ex is sufficiently larger thanthe capacitive value CFDx of the charge accumulation node FDx, thepotential difference Φ between the pixel electrode 61 and the oppositeelectrode 62 is reduced by increasing the offset voltage V_(TP) from thelow-level voltage V_(L) to the voltage V_(H). “|Φ|: Mid” in FIG. 23indicates that the absolute value of potential difference Φ isrelatively small as compared with a state where the low-level voltageV_(L) is applied to the first signal line 31. Due to the reduction ofthe potential difference Φ, the imaging cell 10Ex loses the sensitivityto the wavelength range infrared light, for instance, and selectivelyhas sensitivity to the wavelength range of visible light.

Assume that the capacitive value Cy of the capacitor 25 y of the imagingcell 10Gy is sufficiently smaller than the capacitive value C_(FDy) ofthe charge accumulation node FDy, then even when the offset voltageV_(TP) is increased from the low-level voltage V_(L) to the voltageV_(H), the absolute value of the potential difference Φ between thepixel electrode 61 and the opposite electrode 62 is still a relativelylarge value due to the reason described above. “|Φ|: Lrg” in FIG. 23indicates that the absolute value of the potential difference Φ isrelatively large. Since the absolute value of potential difference Φ isrelatively large, the imaging cell 10Gy has sensitivity in thewavelength ranges of visible light and infrared light, for instance.

Since the offset voltage V_(TP) is increased before the start ofaccumulation of signal charges, the potential of the pixel electrode 61is different between the imaging cell 10Ex and the imaging cell 10Gy atthe start of the charge accumulation period. Therefore, the potentialdifference Φ is also different between the imaging cell 10Ex and theimaging cell 10Gy, and imaging cells with different spectral sensitivitycharacteristics are mixed in the pixel array PA. When the imaging cells10Ex and 10Gy are two adjacent imaging cells in the row direction, andthe pixel array PA has a repetitive structure in which a unit formed bythe cell pair 10Gp including the imaging cells 10Ex and 10Gy isrepeated, it is possible to achieve a state in which imaging cells withdifferent spectral sensitivity characteristics are mixed in the samerow. It is to be noted that the above-mentioned magnitude relationshipof the potential difference Φ indicates a relative relationship, and arelatively high potential difference Φ may be less than 10 V.

Here, the opposite electrode voltage V_(OPP) is a nearly constantvoltage V₁ over the charge accumulation period, and the voltages of thecharge accumulation node FDx and the charge accumulation node FDy afterthe reset are the same voltage Vr. Therefore, at the start of the chargeaccumulation period, in other words, at a time point immediately afterthe reset of the potential of the pixel electrode and before start ofaccumulation of charges in the charge accumulation region, therelationship Φx≠Φy holds between the potential difference Φx applied tothe photoelectric conversion structure 64 of the imaging cell 10Ex andthe potential difference Φy applied to the photoelectric conversionstructure 64 of the imaging cell 10Gy. In other words, the bias voltageapplied to the photoelectric conversion structure 64 before start ofaccumulation of signal charges can be made different between the imagingcell 10Ex and the imaging cell 10G. When the imaging cell 10Ex and theimaging cell 10Gy are arranged close to each other, for instance,adjacent to each other, the quantities of light incident to the imagingcell 10Ex and the imaging cell 10Gy are approximately equal. Therefore,in this case, when the charge accumulation region is in common withthese, it can be said that the difference between the amounts ofelectrical change in each charge accumulation region is small, and therelationship of Φx≠Φy holds over the charge accumulation period. What isnoteworthy here is that conditions are intentionally made such that therelationship of Φx≠Φy holds between the imaging cell 10Ex and imagingcell 10Gy immediately before the accumulation of signal charges.

After the completion of the charge accumulation period, the voltagesupply circuit 41 returns the offset voltage V_(TP) that has beenapplied to the first signal line 31, from the high-level voltage V_(H)to the low-level voltage V_(L). Subsequently, a signal charge is read.When the imaging cells 10Ex and 10Gy are two adjacent imaging cells inthe pixel array PA, the pixel value of one pixel in an image may bedetermined by an image signal obtained by a pair of these imaging cells.For instance, each of multiple pairs of the imaging cells 10Ex and 10Gyincluded in the pixel array PA is associated with each pixel, the outputof the imaging cell 10Ex is extracted from each of the multiple pairs ofthe imaging cells 10Ex and 10Gy included in the pixel array PA, and thepixel value of each pixel may be determined. Thus, an image based onvisible light can be formed. Alternatively, when the pixel value of eachpixel is given by the difference between the output of the imaging cell10Gy and the output of the imaging cell 10Ex, an image based on visiblelight can be formed. The output signal of the imaging cell 10Ex and/orthe output signal of the imaging cell 10Gy may be amplified by apredetermined gain, and subtraction processing may be performed. In thiscase, the gain does not need to be matched between the imaging cells10Ex and 10Gy. It is sufficient that a ratio of gains be determined foreach pair of the imaging cells 10Ex and 10Gy.

Although image signals obtained from both of the imaging cells 10Ex and10Gy arranged close to each other in the pixel array PA are signalsbased on light with different wavelength ranges, synchronization isguaranteed. That is, it is possible to obtain multiple signals based onlight with different wavelength ranges. When the pixel value of onepixel in an image is determined from an image signal obtained by a pairof two adjacent imaging cells in the pixel array PA, a microlens and/ora color filter may be shared by those imaging cells (for instance, theabove-described imaging cells 10Ex and 10Gy). For instance, it is notrequired to dispose a microlens 74 corresponding to each of the imagingcells.

As illustrated in FIG. 23, after completion of reading of signalcharges, accumulation of signal charge can be started continuously. Inother words, it is possible to obtain image signals from multiple framescontinuously, which contributes to reduction of the time taken forimaging.

As description above, according to Embodiments of the presentdisclosure, in a charge accumulation period included in a frame, thepotential difference Φ between the pixel electrode 61 and the oppositeelectrode 62 can be controlled so that the potential difference Φ ismade different between part of the imaging cells and other imaging cellsin the pixel array PA. In an aspect, the potential of the pixelelectrode 61 is changed through the change in the voltage applied to thefirst signal line 31. According to the aspect, it is relatively easy tomake the magnitude of the change in the potential applied to the pixelelectrode 61 different between the imaging cells belonging to the samerow or the same column. An imaging cell, in which the pixel electrode 61is electrically separated from the first signal line 31, may beintentionally mixed in the pixel array PA.

(Variations)

FIG. 24 illustrates a functional block of an imaging module having animaging device according to an Embodiment of the present disclosure. Animaging module 200 illustrated in FIG. 24 has the imaging device 100(for instance, the imaging device 100A) according to one of theabove-described Embodiments, and a processing circuit 110. The imagingmodule 200 processes a signal obtained by the imaging device 100, andoutputs the signal to the outside.

The processing circuit 110 is, for instance, a digital signal processor(DSP), and receives an output (digital pixel signal DS) from the imagingdevice 100. The processing circuit 110 performs processing, such asgamma correction, color interpolation processing, space interpolationprocessing, and auto white balance. The processing circuit 110 may be amicrocomputer that controls the imaging device 100 in accordance withvarious settings specified by a user, and integrates the operations ofthe entire imaging module 200.

The processing circuit 110 processes digital pixel signal DS outputtedfrom the imaging device 100, and calculates an optimal reset voltage(VRG, VRB, and VRR), for instance, for G pixel, B pixel, and R pixel,respectively. The processing circuit 110 feeds back a reset voltage tothe voltage supply circuit 41 of the imaging device 100. Here, VRG, VRB,and VRR indicates a reset voltage for G pixel, a reset voltage for Bpixel, and a reset voltage for R pixel, respectively. The reset voltagemay be a feedback signal sent from the feedback line 33 or the verticalsignal line 34. The imaging device 100 and the processing circuit 110may be manufactured as a single semiconductor device (so-called a systemon a chip (SoC)). Thus, an electronic device using the imaging device100 can be miniaturized. Naturally, it is also possible to produce onlythe imaging device 100 is commercialized without being modulated. Inthis case, a signal processing circuit is externally connected to theimaging device 100, and signal processing may be performed externally ofthe imaging device 100.

As described above, in Embodiments of the present disclosure, at leastvoltage supply circuit 41 out of the voltage supply circuit 41 and thevoltage supply circuit 42 is configured to switch between multiplevoltages and to output a voltage. For instance, the voltage supplycircuit 41 switches between voltages with different absolute valuesbetween a charge accumulation period and a shutter period, and applies avalue to the first signal line 31. It is possible to electrically switchbetween various operations by switching a voltage to be applied to thefirst signal line 31 which is electrically coupled to the pixelelectrode 61. For instance, the sensitivities of the imaging cells inthe pixel array PA are reduced at once by switching a voltage applied tothe first signal line 31, then a global shutter can be operated.

The voltage supply circuit 41 may be configured to apply a predeterminedvoltage to the first signal line 31 at the time of operation of theimaging device. The voltage supply circuit 41 is not limited to aspecific power supply circuit, and may be a circuit that generates apredetermined voltage, or a circuit that converts a voltage suppliedfrom another power supply into a predetermined voltage. Similarly, thevoltage supply circuit 42 connected to the accumulation control line 32may be configured to allow a predetermined voltage to be applied to theaccumulation control line 32 at the time of operation of the imagingdevice. Each of the voltage supply circuits 41 and 42 may be part of asingle voltage supply circuit, or a separate independent voltage supplycircuit. It is to be noted that one or both of the voltage supplycircuits 41 and 42 may be part of the vertical scanning circuit 48.Alternatively, a voltage from the voltage supply circuit 41 and/or anopposite electrode voltage from the voltage supply circuit 42 may besupplied to each imaging cell via the vertical scanning circuit 48.

The voltage supply circuit 41 may be configured to allow any of three ormore different voltages to be applied to the first signal line 31. Avoltage level which can be supplied by switching by the voltage supplycircuit 41 is not limited to a discrete voltage level. The reset voltageV_(RST), the reference voltage V_(REF), or the offset voltage V_(TP) maybe applied as an analog signal from voltage supply circuit 41 to thefirst signal line 31. Similarly, the voltage supply circuit 42 mayswitch between three or more different voltages and may apply a voltagefrom the voltage supply circuit 42 to the accumulation control line 32,or may apply a continuously varying voltage from the voltage supplycircuit 42 to the accumulation control line 32.

(Photoelectric Conversion Structure)

As described above, in Embodiments of the present disclosure, thephotoelectric conversion structure 64 in the photoelectric convertersPC, PCx, and PCy includes a multilayer structure that has the firstphotoelectric conversion layer 64 a and the second photoelectricconversion layer 64 b. The photoelectric conversion structure 64 has athickness in a range 100 nm or greater and 1000 nm or less, forinstance. The first photoelectric conversion layer 64 a and the secondphotoelectric conversion layer 64 b include the first material and thesecond material, respectively, and in an aspect of the presentdisclosure, the first photoelectric conversion layer has greaterimpedance than the second photoelectric conversion layer has. With thisconfiguration, it is possible to switch the spectral sensitivitycharacteristic in the photoelectric converter PC by changing the voltageapplied across the pixel electrode and the opposite electrode. It ispossible to switch the wavelength range of an obtainable image byswitching the spectral sensitivity characteristic in the imaging cell10. It is to be noted that in the present description, for the sake ofsimplicity, the term of “impedance” may be used to indicate “absolutevalue of impedance”.

In another aspect in the present disclosure, the ionization potential ofthe first material is greater than the ionization potential of thesecond material by 0.2 eV or more. As described later, when thedifference between the ionization potentials of the first material andthe second material is high to some extent, even when the impedancedifference between the first photoelectric conversion layer 64 a and thesecond photoelectric conversion layer 64 b is small, the spectralsensitivity characteristic in the photoelectric converter PC can bechanged by changing the voltage applied across the pixel electrode andthe opposite electrode.

FIG. 25 illustrates an instance of the sectional structure of thephotoelectric converter.

As already described, the photoelectric converter PC includes the pixelelectrode 61, the opposite electrode 62, and the photoelectricconversion structure 64 interposed therebetween. The photoelectricconversion structure 64 typically has multiple layers including anorganic material. In the configuration illustrated to FIG. 25, thephotoelectric conversion structure 64 includes a multilayer structure ofthe first photoelectric conversion layer 64 a and the secondphotoelectric conversion layer 64 b. As illustrated, in this instance,the second photoelectric conversion layer 64 b is positioned between thefirst photoelectric conversion layer 64 a and the opposite electrode 62.

In the configuration illustrated to FIG. 25, the photoelectricconversion structure 64 includes an electronic blocking layer 64 eb anda positive hole transport layer 64 ht between the first photoelectricconversion layer 64 a and the pixel electrode 61. The electronicblocking layer 64 eb is adjacent to the pixel electrode 61, and thepositive hole transport layer 64 ht is adjacent to the firstphotoelectric conversion layer 64 a. Also, the photoelectric conversionstructure 64 includes an electron transport layer 64 et and a positivehole blocking layer 64 hb between the second photoelectric conversionlayer 64 b and the opposite electrode 62. The positive hole blockinglayer 64 hb is adjacent to the opposite electrode 62, and the electrontransport layer 64 et is adjacent to the second photoelectric conversionlayer 64 b.

The electronic blocking layer 64 eb illustrated in FIG. 25 is providedto reduce dark current caused by injection of electrons from the pixelelectrode 61, and the positive hole blocking layer 64 hb is provided toreduce dark current caused by injection of positive holes from theopposite electrode 62. It is to be noted that the electronic blockinglayer 64 eb and the positive hole blocking layer 64 hb each have afunction of selectively transporting charges, and therefore are notinsulation layers. The positive hole transport layer 64 ht and theelectron transport layer 64 et are provided to efficiently transportpositive and negative charges generated in the first photoelectricconversion layer 64 a and/or the second photoelectric conversion layer64 b to the pixel electrode 61 and the opposite electrode 62,respectively. The materials of which the electronic blocking layer 64eb, the positive hole blocking layer 64 hb, the positive hole transportlayer 64 ht, and the electron transport layer 64 et are composed can beselected from publicly known materials in consideration of bondingstrength, stability, a difference between ionization potentials, and adifference between electron affinities between each layer and adjacentlayer. The material for forming the first photoelectric conversion layer64 a or the material for forming the second photoelectric conversionlayer 64 b may be for at least one of the materials of which theelectronic blocking layer 64 eb, the positive hole blocking layer 64 hb,the positive hole transport layer 64 ht, and the electron transportlayer 64 et are composed.

The first photoelectric conversion layer 64 a and the secondphotoelectric conversion layer 64 b include the first material and thesecond material, respectively. Therefore, typically, impedance per unitthickness in the first photoelectric conversion layer 64 a is differentfrom impedance per unit thickness in the second photoelectric conversionlayer 64 b. The first material and the second material are typicallysemiconductor materials. In an aspect of the present disclosure,impedance per unit thickness in the first photoelectric conversion layer64 a is greater than impedance per unit thickness in the secondphotoelectric conversion layer 64 b. The impedance depends on thethickness of a photoelectric conversion layer, and when a photoelectricconversion layer includes multiple materials, the impedance also dependson the volume ratio of those materials in the photoelectric conversionlayer. In Embodiments of the present disclosure, a layer having highimpedance among multiple photoelectric conversion layers included in themultilayer structure can be used as the first photoelectric conversionlayer 64 a.

(Switching of Spectral Sensitivity Characteristic by Switching BiasVoltage Utilizing Impedance Difference)

When the photoelectric conversion structure 64 includes a multilayerstructure having the first photoelectric conversion layer and the secondphotoelectric conversion layer which have different impedance,application of a bias voltage between the pixel electrode 61 and theopposite electrode 62 causes a voltage proportional to the differentimpedance to be applied to the first photoelectric conversion layer andthe second photoelectric conversion layer. In other words, an electricfield with a magnitude proportional to impedance is applied to the firstphotoelectric conversion layer and the second photoelectric conversionlayer. An external quantum efficiency (E.Q.E.) for a wavelength rangecan be changed by changing the potential difference Φ to be appliedacross the pixel electrode 61 and the opposite electrode 62 thatinterpose a photoelectric conversion structure including a multilayerstructure having photoelectric conversion layers with differentimpedance. In other words, in the imaging cell 10 having such aphotoelectric conversion structure in the photoelectric converter PC,the spectral sensitivity characteristic may be electrically changed. Forinstance, when the potential difference to be applied is changed frompotential difference Φ1 to the potential difference Φ2, an increase inthe E.Q.E. in the absorption peak wavelength of the second material isgreater than an increase in the E.Q.E. in the absorption peak wavelengthof the first material.

For instance, let Z1 and Z2 be the impedance of the first photoelectricconversion layer 64 a, and the impedance of the second photoelectricconversion layer 64 b, respectively, then when Z1>Z2, a higher voltageis applied to the first photoelectric conversion layer 64 a as comparedwith the second photoelectric conversion layer 64 b. Therefore, evenwhen the bias between the pixel electrode 61 and the opposite electrode62 is small, an electric field having a sufficient magnitude for movingthe charges generated by the photoelectric conversion to an electrodecan be applied to the first photoelectric conversion layer 64 a. Inother words, positive and negative charges generated by thephotoelectric conversion can reach the pixel electrode 61 and theopposite electrode 62, respectively. Specifically, signal chargesgenerated by irradiation of the first photoelectric conversion layer 64a with light are collected by the pixel electrode 61, and areaccumulated in the charge accumulation region.

On the other hand, the electric field applied to the secondphotoelectric conversion layer 64 b is smaller than the electric fieldapplied to the first photoelectric conversion layer 64 a. Thus, when asmaller potential difference is applied to the photoelectric conversionstructure 64 between the pixel electrode 61 and the opposite electrode62, the electric field applied to the second photoelectric conversionlayer 64 b may fall below a necessary magnitude for signal charges toreach the pixel electrode 61, the signal charges being generated byirradiation of the second photoelectric conversion layer 64 b withlight. If signal charges do not reach the pixel electrode 61, even whensignal charges are generated in the second photoelectric conversionlayer 64 b, the signal charges are not accumulated in the chargeaccumulation region. Therefore, the imaging cell 10 does not havesufficient sensitivity to the light with a wavelength rangecorresponding to the absorption spectrum of the material of which thesecond photoelectric conversion layer 64 b is composed, particularly theabsorption spectrum of the second material.

When the voltage applied across the opposite electrode 62 and the pixelelectrode 61 is increased, the voltage applied to the secondphotoelectric conversion layer 64 b is also increased. That is, theelectric field applied to the second photoelectric conversion layer 64 bis increased, and the signal charges reach the pixel electrode 61, forinstance, by supplying a voltage with a larger absolute value to pixelelectrode 61 or the opposite electrode 62. Therefore, the imaging cell10 has sensitivity to the light with a wavelength range corresponding tothe absorption spectrum of the material (particularly, the secondmaterial) of which the second photoelectric conversion layer 64 b, inaddition to the light with a wavelength range corresponding to theabsorption spectrum of the material (particularly, the first material)of which the first photoelectric conversion layer 64 a is composed.

In this manner, a multilayer structure having the first photoelectricconversion layer, and the second photoelectric conversion layer whichhas impedance smaller than impedance of the first photoelectricconversion layer is applied, and thus the spectral sensitivitycharacteristic can be switched by switching a voltage supplied to thepixel electrode 61 or the opposite electrode 62. The ratio of theimpedance of the first photoelectric conversion layer 64 a to theimpedance of the second photoelectric conversion layer 64 b is typicallyin a range of 100 times or more and 10¹⁰ times or less. When the ratioof the impedance of the first photoelectric conversion layer 64 a to theimpedance of the second photoelectric conversion layer 64 b exceeds atleast 44 times, such switching of the spectral sensitivitycharacteristic by switching the bias voltage can be achieved.

As the combination of the first material and the second material, forinstance, a combination of a material exhibiting a high absorptioncoefficient in visible range and a material exhibiting a high absorptioncoefficient in infrared range may be used. With this combination ofmaterials, it is possible to provide an imaging device that can obtaininformation on one or both of illumination of visible light andillumination of infrared light.

Typically, the first photoelectric conversion layer 64 a and the secondphotoelectric conversion layer 64 b include electron-donating (donorproperty, p-type) molecules, and electron-accepting (acceptor property,n-type) molecules.

For instance, electron-donating molecules are used as the first materialand the second material. A typical instance of electron-donatingmolecules is an organic p-type semiconductor, and is mainly representedby a positive hole transport organic compound. The electron-donatingmolecules have a property of being likely to donate electrons. Examplesof an organic p-type semiconductor include triaryl amine compounds suchas DTDCTB, benzidine compounds, pyrazoline compounds, styryl aminecompounds, hydrazone compounds, triphenylmethane compounds, carbazolecompounds, polysilane compounds, α-sexithiophene (hereinafter referredto as “α-6T”), thiophene compounds such as P3HT, phthalocyaninecompounds, cyanine compounds, merocyanine compounds, oxonol compounds,polyamine compounds, indolic compounds, pyrrole compounds, pyrazolecompounds, polyarylene compounds, condensed aromatic carbon ringcompounds, (naphthalene derivatives, anthracene derivatives,phenanthrene derivatives, tetracene derivatives such as rubrene, pyrenederivatives, perylene derivatives, fluoranthene derivatives), and metalcomplexes having a nitrogen-containing hetero ring compound as a ligand.Examples of phthalocyanine compounds include copper phthalocyanine(CuPc), subphthalocyanine (SubPc), aluminium chloride phthalocyanine(CIAIPc), Si(OSiR₃)₂Nc (R indicates alkyl with a carbon number of 1 to18), turnip phthalocyanine (SnNc), and lead phthalocyanine (PbPc). Donororganic semiconductors are not limited to these, and organic compoundswith an ionization potential lower than the ionization potential oforganic compounds used as n-type (acceptor property) compounds can beused as donor organic semiconductors. The ionization potential is thedifference between the vacuum level and the energy level of a highestoccupied molecular orbital (HOMO).

A typical instance of electron-accepting molecules is an organic n-typesemiconductor, and is mainly represented by an electron transportorganic compound. The electron-accepting molecules have a property ofbeing likely to accept electrons. Examples of an organic n-typesemiconductor include fullerene such as C₆₀ and C₇₀, fullerenederivatives such as phenyl C₆₁ butyric-acid methyl ester (PCBM),condensed aromatic carbon ring compounds, (naphthalene derivatives,anthracene derivatives, phenanthrene derivatives, tetracene derivatives,pyrene derivatives, perylene derivatives, fluoranthene derivatives), 5to 7 membered hetero ring compounds containing nitrogen atoms, oxygenatoms, and sulfur atoms (for instance, pyridine, pyrazine, pyrimidine,pyridazine, triazine, quinoline, quinoxaline, quinazoline, phthalazine,cinnoline, isoquinoline, pteridine, acridine, phenazine, phenanthroline,tetrazole, pyrazole, imidazole, thiazole, oxazole, indazole,benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole,purine, triazolo-pyridazine, triazolo-pyrimidine, tetrazaindene,oxadiazole, imidazopyridine, pyrrolidine, pyrrolopyridine,thiadiazolopyridine, dibenzazepine, tribenzazepine), subphthalocyanine(SubPc), polyarylene compounds fluorene compounds, cyclopentadienecompounds, silyl compounds, perylene tetracarboxylic diimide compounds(PTCDI), and metal complexes having a nitrogen-containing hetero ringcompound as a ligand. Acceptor organic semiconductors are not limited tothese, and organic compounds with an electron affinity greater than theelectron affinity of organic compounds used as p-type (donor property)compounds can be used as acceptor organic semiconductors. The electronaffinity is the difference between the vacuum level and the energy levelof a lowest unoccupied molecular orbital (LUMO).

FIG. 26 illustrates the chemical formulas of SnNc, DTDCTB, and C₇₀.Without being limited to those mentioned above, as long as organiccompounds or organic molecules allows film formation by one of a drysystem and a wet system, the organic compounds and organic molecules canbe used as the material of which the first photoelectric conversionlayer 64 a is composed or the material of which the second photoelectricconversion layer 64 b is composed, regardless of low-molecular orhigh-molecular compounds.

A photoelectric conversion structure 64 having sensitivity of a desiredwavelength range can be implemented by using appropriate materials asthe first material and the second material according to a wavelengthrange to be detected. For instance, a material having a high absorptioncoefficient in the visible range and a material having a high absorptioncoefficient in the infrared range may be used as the first material andthe second material, respectively. The above-mentioned DTDCTB has anabsorption peak at a wavelength of approximately 700 nm, and CuPc andSubPc have absorption peaks at wavelengths of approximately 620 nm and580 nm, respectively. Rubrene has an absorption peak at a wavelength ofapproximately 530 nm, and α-6T has an absorption peak at a wavelength ofapproximately 440 nm. In short, the absorption peaks of these materialsare in the wavelength range of visible light, and can be used as thefirst material, for instance. In contrast, SnNc has an absorption peakat a wavelength of approximately 870 nm, and CIAIPc has an absorptionpeak at a wavelength of approximately 750 nm. In short, the absorptionpeaks of these materials are in the wavelength range of infrared light,and can be used as the second material, for instance.

The second material includes SnNc represented by the followingstructural formula (1), for instance.

R¹ to R²⁴ in the structural formula (1) each independently indicate ahydrogen atom or a substituent. The substituent is not limited to aspecific substituent. The substituent may be a deuterium atom, a halogenatom, alkyl groups (including a cycloalkyl group, a bicycloalkyl group,a tricycloalkyl group), an alkenyl group (including a cycloalkenylgroup, a bicycloalkenyl group), an alkynyl group, an aryl group, aheterocyclic group (may be called a heterocyclic group), a cyano group,a hydroxy group, a nitro group, a carboxy group, an alkoxy group, anaryloxy group, a silyloxy group, a heterocyclic oxy group, a acyloxygroup, a carbamoyloxy group, an alkoxy carbonyloxy group, an aryloxycarbonyloxy group, an amino group (including an anilino group), anammonio group, an acylamino group, an aminocarbonyl amino group, analkoxycarbonylamino group, an aryloxycarbonylamine group, anaryloxycarbonylamine group, a sulfamoylamino group, analkylsulfonylamino group, arylsulfonylamino group, an mercapto group, analkylthio group, an arylthio group, a heterocyclic thio group, asulfamoyl group, a sulfonic group, an alkylsulfinyl group, anarylsulfinyl group, an alkylsulfonyl group, an arylsulfonyl group, anacyl group, an aryloxycarbonyl group, an alkoxycarbonyl group, acarbamoyl group, an arylazo group, a heterocyclic azo group, an imidegroup, a phosphino group, a phosphinyl group, a phosphinyloxy group, aphosphinyl amino group, a phosphono group, a silyl group, a hydrazinogroup, a ureido group, a boron acid group (—B(OH)₂), a phosphato group(—OPO(OH)₂), a sulphato group (—OSO₃H), or other publicly knownsubstituent groups.

Commercially available products may be used as SnNc represented by theabove-mentioned structural formula (1). Alternatively, for instance, asdescribed in Japanese Unexamined Patent Application Publication No.2010-232410, SnNc represented by the above-mentioned structural formula(1) can be synthesized using naphthalene derivative represented by thestructural formula (2) below as starting material. R²⁵ to R³⁰ in thestructural formula (2) can be the same substituent groups as R¹ to R²⁴in the structural formula (1).

From the viewpoint of easiness of control over aggregation state ofmolecules in tin naphthalocyanine represented by the above-mentionedstructural formula (1), it is useful when eight or more of R¹ to R²⁴ areeach a hydrogen atom or a deuterium atom, and it is more useful when 16or more of R¹ to R²⁴ are each a hydrogen atom or a deuterium, and it isfurther useful when all of R¹ to R²⁴ are each a hydrogen atom or adeuterium. In addition, SnNc represented by the following structuralformula (3) is advantageous from the viewpoint of easiness of synthesis.

SnNc represented by the above-mentioned structural formula (1) has anabsorption in a wavelength range of approximately 200 nm or more and1100 nm or less. For instance, SnNc represented by the above-mentionedstructural formula (3) has an absorption peak at a wavelength ofapproximately 870 nm as illustrated in FIG. 30. FIG. 30 is an instanceof an absorption spectrum in a photoelectric conversion layer includingSnNc represented by the above-mentioned structural formula (3). It is tobe noted that for the measurement of an absorption spectrum, a samplewas used in which a photoelectric conversion layer with a thickness of30 nm is stacked on a quartz substrate.

For instance, a material having an absorption peak in a first wavelengthrange included in the visible range is used as the first material, and amaterial having an absorption peak in a second wavelength range includedin the infrared range is used as the second material, thereby making itpossible to electrically change the sensitivity in the infrared range.Needless to say, a material having a high absorption coefficient in theinfrared range and a material having a high absorption coefficient inthe visible range may be used as the first material and the secondmaterial, respectively.

For instance, it is assumed that impedance Z1 of the first photoelectricconversion layer for which a material having a high absorptioncoefficient in the visible light is used as the first material isgreater than impedance Z2 of the second photoelectric conversion layerfor which a material having a high absorption coefficient in theinfrared light is used as the second material (Z1>Z2). At this point,when the voltage applied across the opposite electrode 62 and the pixelelectrode 61 is lower than or equal to a threshold value, thephotoelectric converter PC has a relatively high sensitivity in thevisible range. Therefore, an image signal based on the visible light canbe obtained. On the other hand, when the voltage applied across theopposite electrode 62 and the pixel electrode 61 is higher than athreshold value, the photoelectric converter PC has sensitivity in thevisible range and the infrared range. Therefore, an image signal basedon the visible light and the infrared light can be obtained. In otherwords, let Φ1 be a voltage that allows imaging with the visible light,and let Φ2 be a voltage that allows imaging with the visible light andthe infrared light in the potential difference applied across theopposite electrode 62 and the pixel electrode 61, then the relationshipof Φ1<Φ2 holds.

Conversely, when the impedance Z1 of the first photoelectric conversionlayer is lower than the impedance Z2 of the second photoelectricconversion layer (Z1<Z2), and the voltage applied across the oppositeelectrode 62 and the pixel electrode 61 is lower than or equal to athreshold value, the photoelectric converter PC has a relatively highsensitivity in the infrared range. Consequently, the imaging deviceaccording to an Embodiment of the present disclosure can obtain an imagesignal based on the infrared light. On the other hand, when the voltageapplied across the opposite electrode 62 and pixel electrode 61 higherthan a threshold value, the photoelectric converter PC has sensitivityin the visible light range and the infrared light range. Therefore, animage signal based on the visible light and the infrared light can beobtained. At this point, let Φ3 be a potential difference that allowsimaging with the infrared light, and let Φ4 be a potential differencethat allows imaging with the visible light and the infrared light in thevoltage applied across the opposite electrode 62 and the pixel electrode61, then the relationship of Φ3<Φ4 holds after all. What is noteworthyhere is that the wavelength range of an obtainable image can be switchedby the potential difference applied across the opposite electrode 62 andthe pixel electrode 61.

When the first photoelectric conversion layer 64 a and the secondphotoelectric conversion layer 64 b do not sufficiently have desiredsensitivity characteristic by using a single organic material, one orboth of the first photoelectric conversion layer 64 a and the secondphotoelectric conversion layer 64 b may be formed by mixing two or moreorganic materials. Alternatively, one or both of the first photoelectricconversion layer 64 a and the second photoelectric conversion layer 64 bmay be formed by stacking two or more layers including different organicmaterials. The first photoelectric conversion layer 64 a and/or thesecond photoelectric conversion layer 64 b may be, for instance, a bulkheterojunction structure layer including a p-type semiconductor and ann-type semiconductor. The bulk heterojunction structure is described indetail in Japanese Patent No. 5553727. The entire contents of JapanesePatent No. 5553727 are incorporated herein by reference.

FIG. 27 illustrates another instance of the sectional structure of thephotoelectric converter PC. The photoelectric conversion structure 64Aillustrated in FIG. 27 includes a multilayer structure having the firstphotoelectric conversion layer 64 a, a mixed layer 64 m, and the secondphotoelectric conversion layer 64 b. The mixed layer 64 m is a layerthat includes the first material and the second material at least, andis positioned between the first photoelectric conversion layer 64 a andthe second photoelectric conversion layer 64 b. It is to be noted thatFIG. 27 and the aforementioned FIG. 25 are merely schematic diagrams,and the boundary of each layer included in the photoelectric conversionstructure may not be strictly defined. The same goes with othersectional views of the present disclosure.

As just described, the configuration of the photoelectric converter PCis not limited to the configuration illustrated in FIG. 25. Forinstance, the arrangement of the first photoelectric conversion layer 64a and the second photoelectric conversion layer 64 b and the arrangementillustrated in FIGS. 25 and 27 may be reversed. When negative charges(typically, electrons) among positive and negative charges generated inthe photoelectric conversion structure 64 are used as signal charges, apositive hole blocking layer and an electron transport layer may be usedinstead of the electronic blocking layer 64 eb and the positive holetransport layer 64 ht, and a positive hole transport layer and anelectronic blocking layer may be used instead of the electron transportlayer 64 et and the positive hole blocking layer 64 hb.

The material of which the first photoelectric conversion layer 64 a andthe second photoelectric conversion layer 64 b are composed is notlimited to an organic semiconductor material, and the firstphotoelectric conversion layer 64 a and/or the second photoelectricconversion layer 64 b may include a compound semiconductor representedby hydrogenation amorphous silicon, CdSe, and an inorganic semiconductormaterial of a metal oxide semiconductor such as ZnO. For instance, thevolume resistivity of amorphous silicon is adjustable by changing animpurity density. The first photoelectric conversion layer 64 a and/orthe second photoelectric conversion layer 64 b may include a layercomposed of an organic material and a layer composed of an inorganicmaterial.

(Switching of Spectral Sensitivity Characteristic by Switching BiasVoltage Utilizing Ionization Potential Difference)

As described below, even when the impedance difference between the firstphotoelectric conversion layer 64 a and the second photoelectricconversion layer 64 b is small, when the difference between theionization potentials of the first material and the second material ishigh to some extent, the spectral sensitivity characteristic can bechanged by changing the potential difference Φ between the pixelelectrode 61 and the opposite electrode 62.

FIG. 28 is an energy diagram in still another configuration instance ofthe photoelectric converter PC. The rectangles in FIG. 28, schematicallyillustrate LUMO and HOMO in each material. The numerical value givennear each of the upper sides and the lower sides of these rectanglesindicates the electron affinity and the ionization potential of eachmaterial. The thick horizontal lines in FIG. 28 schematically indicatethe exemplary Fermi levels of the opposite electrode 62 and the pixelelectrode 61.

In the configuration illustrated to FIG. 28, the photoelectricconversion structure 64B has a multilayer structure in which theelectronic blocking layer 64 eb, the first photoelectric conversionlayer 64 a, and the second photoelectric conversion layer 64 b arestacked from the pixel electrode 61 to the opposite electrode 62. Inthis instance, as the first material, the second material, and thematerial for the electronic blocking layer 64 eb, rubrene, SnNc, and bis(carbazolyl) benzodifuran (CZBDF) which is an ambipolar organicsemiconductor are used, respectively. FIG. 29 illustrates the chemicalformula of CZBDF. AS schematically illustrated in FIG. 28, the firstphotoelectric conversion layer 64 a and the second photoelectricconversion layer 64 b include C₇₀ as an acceptor organic semiconductor.The first photoelectric conversion layer 64 a in this instance receivesthe visible light to generate charge pairs by photoelectric conversion,and the second photoelectric conversion layer 64 b receives the infraredlight to generate charge pairs by photoelectric conversion. Each opencircle “◯” and solid circle “●” in FIG. 28 respectively indicate apositive charge and a negative charge generated by photoelectricconversion.

As already described, when positive charges are collected by the pixelelectrode 61, a predetermined voltage is supplied to the oppositeelectrode 62, for instance, and the opposite electrode 62 has a higherpotential than the potential of the pixel electrode 61. In this state,when the visible light is incident to the first photoelectric conversionlayer 64 a and positive and negative charges are generated in the firstphotoelectric conversion layer 64 a, the positive charges are collectedby the pixel electrode 61. Specifically, the imaging cell 10 hassensitivity to the wavelength range of visible light with signal chargesgenerated by irradiation with visible light accumulated in a chargeaccumulation region. The negative charges transfer from the LUMO levelto the LUMO level of C₇₀, and moves toward the opposite electrode 62 bythe electric field between the pixel electrode 61 and the oppositeelectrode 62. Since C₇₀ is used in common as an acceptor organicsemiconductor between the first photoelectric conversion layer 64 a andthe second photoelectric conversion layer 64 b, the negative charges,which have transferred to the LUMO level of C₇₀, continuously move tothe opposite electrode 62, and can be collected by the oppositeelectrode 62.

Here, a state is assumed in which infrared light is incident to thesecond photoelectric conversion layer 64 b, and positive and negativecharges are generated in the second photoelectric conversion layer 64 b.When attention is focused on the positive charges, the positive chargesmove toward the pixel electrode 61 by the electric field between thepixel electrode 61 and the opposite electrode 62. However, asillustrated in FIG. 28, the ionization potential of rubrene is greaterthan the ionization potential of SnNc, and thus a potential barrier forthe positive charges is formed between the HOMO level of SnNc and theHOMO level of rubrene. Therefore, when the bias between the pixelelectrode 61 and the opposite electrode 62 is low, the positive chargescannot overcome the potential barrier, and do not reach the pixelelectrode 61. This indicates a state in which the imaging cell 10 has nosensitivity to the wavelength range of infrared light.

When the bias between the pixel electrode 61 and the opposite electrode62 is increased, and energy for overcoming the potential barrier isgiven to the positive charges, the positive charges overcome thepotential barrier, and reach the pixel electrode 61. That is, thepositive charges generated in the second photoelectric conversion layer64 b can be collected by the pixel electrode 61 by applying a greaterpotential difference between the pixel electrode 61 and the oppositeelectrode 62. In other words, sensitivity in the wavelength range ofinfrared light can be given to the imaging cell 10 by switching thepotential difference Φ to be applied across the pixel electrode 61 andthe opposite electrode 62. At this point, the imaging cell 10 hassensitivity in the wavelength ranges of visible light and infraredlight, for instance.

When the difference Φ from the ionization potential of the secondmaterial to the ionization potential of the first material isapproximately 0.2 eV or more, the effect of such switching of spectralsensitivity characteristic by switching the potential difference Φ isobtained. At this point, as illustrated in FIG. 28, in a configurationin which the second photoelectric conversion layer 64 b is positionedbetween the first photoelectric conversion layer 64 a and the oppositeelectrode 62, it is only necessary to cause the opposite electrode 62 tobe higher in potential than the pixel electrode 61.

Like this, when the ionization potential of the first material isgreater than the ionization potential of the second material by acertain difference or more, the spectral sensitivity characteristic inthe imaging cell 10 can be electrically switched even when the impedancedifference between the first photoelectric conversion layer 64 a and thesecond photoelectric conversion layer 64 b is low. Impedance differencemay be further provided between the first photoelectric conversion layer64 a and the second photoelectric conversion layers 64 b such that theimpedance difference is sufficiently large to allow the spectralsensitivity characteristic to be electrically switched.

A HOMO level of organic material can be determined, for instance, basedon photoelectron spectroscopy, and photoemission yield spectroscopy.Also, a LUMO level may be determined based on inverse photoemissionspectroscopy or by subtracting the energy at an absorption spectrum endfrom the HOMO level.

EXAMPLES

A sample having a multilayer structure similar to an instance of theabove-described photoelectric converter PC was produced, and the changeof spectral sensitivity characteristic with respect to the change of thebias in the produced sample was evaluated by measuring E.Q.E. with thebias changed. The sample was produced in the following manner.

Example 1-1

First, a glass substrate was prepared. Subsequently, the materialslisted in Table 1 were deposited sequentially on a glass substrate byvacuum deposition, and thus a multilayer structure is formed on theglass substrate, the multilayer structure including a lower-surfaceelectrode, an electronic blocking layer, a lower-side photoelectricconversion layer, an upper-side photoelectric conversion layer, and anupper-surface electrode. Table 1 also illustrates the thickness of eachlayer formed. In the formation of the lower-side photoelectricconversion layer, SnNc and C₇₀ were co-evaporated. Similarly, theupper-side photoelectric conversion layer was formed by co-evaporatingDTDCTB and C₇₀. In the formation of the lower-side photoelectricconversion layer and the formation of the upper-side photoelectricconversion layer, the conditions for vapor deposition were adjusted sothat the volume ratio between SnNc and C₇₀, and the volume ratio betweenDTDCTB and C₇₀ become 1:1. In this manner, the sample of Example 1-1 wasobtained.

TABLE 1 THICKNESS LAYER MATERIAL (nm) UPPER-SURFACE ELECTRODE Al 80UPPER-SIDE PHOTOELECTRIC DTDCTB:C₇₀ 60 CONVERSION LAYER (1:1) LOWER-SIDEPHOTOELECTRIC SnNc:C₇₀ (1:1) 60 CONVERSION LAYER ELECTRON BLOCKING LAYERCZBDF 10 LOWER-SURFACE ELECTRODE ITO 150

Next, spectral sensitivity measuring device CEP-25RR manufactured byBunkoukeiki Co., Ltd was connected to the lower-surface electrode andthe upper-surface electrode, and E.Q.E. in the sample of Example 1-1 wasmeasured while changing the bias to be applied across the lower-surfaceelectrode and the upper-surface electrode. Here, with the quantity oflight to a measurement target fixed, E.Q.E. was measured by changing thepotential of the lower-surface electrode to −3 V, −5 V, −8 V, −10 V, and−11 V with the potential of the upper-surface electrode is grounded.Application of these biases corresponds to the configuration in whichpositive charges are collected by the pixel electrode 61 in theabove-described photoelectric converter PC. Specifically, in thisinstance, positive charges generated by photoelectric conversion movetoward the lower-surface electrode, and the lower-surface electrode andthe upper-surface electrode in the sample of Example 1-1 can beassociated with the pixel electrode 61 and the opposite electrode 62 inthe above-described photoelectric converter PC, respectively. However,because light was incident from the glass substrate side in themeasurement, ITO was used as the material for the lower-surfaceelectrode, and Al was used as the material for the upper-surfaceelectrode.

FIG. 31 illustrates the voltage dependence of E.Q.E. in the sample ofExample 1-1. Each of the graphs illustrated in FIG. 31 is normalized sothat the peak value of E.Q.E. equals 1. It is to be noted that in eachgraph after FIG. 31 related to the voltage dependence of E.Q.E., isnormalized so that the peak value of E.Q.E. equals 1.

When the absolute value of the bias voltage applied to the lower-surfaceelectrode is small, in other words, when the potential differenceapplied across two electrodes is low, it is found from FIG. 31 thatE.Q.E. in near an absorption peak position of SnNc included in thelower-side photoelectric conversion layer has a relatively low value. Inshort, the sensitivity in the infrared range is low. In contrast, in thevisible range where DTDCTB included in the upper-side photoelectricconversion layer has an absorption peak, a relatively high E.Q.E. wasobtained. Furthermore, it is found from FIG. 31 that when the absolutevalue of the bias voltage applied to the lower-surface electrode isincreased, the E.Q.E. in the infrared range increases as the absolutevalue of the bias voltage is increased. Consequently, it is found thatsensitivity in the wavelength range corresponding to the absorptionspectrum of SnNc increases depending on the magnitude of the bias.

For instance, at the wavelength (near 870 nm) corresponding to theabsorption peak of SnNc, the E.Q.E. when the potential of thelower-surface electrode was set to −3 V is compared with the E.Q.E. whenthe potential of the lower-surface electrode was set to −11 V, thelatter was approximately 33.7 times the former. It is although it didnot illustrate in FIG. 31, at the wavelength (near 870 nm) correspondingto the absorption peak of SnNc, the E.Q.E. when the potential of thelower-surface electrode was set to −15 V was approximately 33.7 timesthe E.Q.E. when the potential of the lower-surface electrode was set to−3 V.

Next, the impedance of the upper-side photoelectric conversion layer wascompared with the impedance of the lower-side photoelectric conversionlayer. For the measurement of impedance, a sample having only theupper-side photoelectric conversion layer between the lower-surfaceelectrode and the upper-surface electrode, and a sample having only thelower-side photoelectric conversion layer between the lower-surfaceelectrode and the upper-surface electrode were used. The configurationof the sample used for measurement of the impedance of the upper-sidephotoelectric conversion layer is the same as the configuration of thesample of Example 1-1 except that the lower-side photoelectricconversion layer and the electronic blocking layer were not formed, andthe thickness of the upper-side photoelectric conversion layer was 200nm. The configuration of the sample used for measurement of theimpedance of the lower-side photoelectric conversion layer is the sameas the configuration of the sample of Example 1-1 except that theupper-side photoelectric conversion layer and the electronic blockinglayer were not formed, and the thickness of the lower-side photoelectricconversion layer was 200 nm. For the measurement and analysis of theimpedance, ModuLab XM ECS manufactured by TOYO Corporation and Zplotsoftware were used. Frequency sweep mode was used as the operation mode,the amplitude was set to 10 mV, and the frequency was changed from 1 Hzto 1 MHz. Measurement was made with start delay of 5 sec. The values ofimpedance were compared between the upper-side photoelectric conversionlayer and the lower-side photoelectric conversion layer with the biasvoltage to the lower-surface electrode with respect to the upper-surfaceelectrode at −8 V and the frequency at 1 Hz.

The value of impedance with the bias voltage of −8 V and the frequencyof 1 Hz was 7.5×10⁶Ω, for the upper-side photoelectric conversion layerincluding DTDCTB, and 4.2×10³Ω for the lower-side photoelectricconversion layer including SnNc. That is, the impedance of theupper-side photoelectric conversion layer was approximately 1800 timesgreater than the impedance of the lower-side photoelectric conversionlayer.

FIG. 32 illustrates the relationship between E.Q.E. and applied electricfield with wavelengths of 460 nm, 540 nm, 680 nm, and 880 nm for thesample of Example 1-1. The horizontal axis of the graph illustrated inFIG. 32 indicates the value obtained by dividing the bias voltageapplied across the upper-surface electrode and the lower-surfaceelectrode by the sum of thicknesses of the upper-side photoelectricconversion layer, the lower-side photoelectric conversion layer, and theelectronic blocking layer. That is, the horizontal axis of the graphillustrated in FIG. 32 corresponds to the magnitude of the electricfield applied across the upper-surface electrode and the lower-surfaceelectrode.

In the instance illustrated in FIG. 32, the E.Q.E. for the light with awavelength of 880 nm is substantially zero with the electric fieldstrength less than approximately 4×10⁵ V/cm, and the E.Q.E. starts toincrease with the electric field strength of a threshold value orgreater, here approximately 4×10⁵ V/cm or greater. A sufficiently highbias can be applied to a layer having relatively lower impedance of twophotoelectric conversion layers by applying a sufficiently high bias tothe photoelectric conversion structure (for instance, see FIG. 25)including a multilayer structure having the first and secondphotoelectric conversion layers. From FIG. 32, it is found that when asufficiently high bias is applied to a layer (that is, here thelower-side photoelectric conversion layer) having relatively lowerimpedance between two photoelectric conversion layers, the E.Q.E. of thelayer has a relatively large value. From FIG. 32, it is found that theE.Q.E. for each of wavelengths 460 nm, 540 nm, 680 nm, and 880 nm tendsto be saturated when the magnitude of the electric field between theupper-surface electrode and the lower-surface electrode is approximately9×10⁵ V/cm or greater.

Reference Example 1

A sample of Reference Example 1 substantially the same as the sample ofExample 1-1 was produced except that a mixed layer including SnNc andDTDCTB was disposed between the lower-side photoelectric conversionlayer and the upper-side photoelectric conversion layers. Table 2 belowlists the material and the thickness of each layer in the sample ofReference Example 1. The mixed layer was formed by co-evaporating threematerials: SnNc, DTDCTB, and C₇₀. In the formation of the mixed layer,the conditions for vapor deposition were adjusted so that the volumeratio between SnNc, DTDCTB, and C₇₀ becomes 1:1:8. Also, in theformation of the lower-side photoelectric conversion layer and theformation of the upper-side photoelectric conversion layer, theconditions for vapor deposition were adjusted so that the volume ratiobetween SnNc and C₇₀, and the volume ratio between DTDCTB and C₇₀ become1:4.

TABLE 2 THICKNESS LAYER MATERIAL (nm) UPPER-SURFACE ELECTRODE Al 80UPPER-SIDE PHOTOELECTRIC DTDCTB:C₇₀ 50 CONVERSION LAYER (1:4) MIXEDLAYER SnNc:DTDCTB:C₇₀ 20 (1:1:8) LOWER-SIDE SnNc:C₇₀ (1:4) 50PHOTOELECTRIC CONVERSION LAYER ELECTRON BLOCKING LAYER CZBDF 10LOWER-SURFACE ITO 150 ELECTRODE

Similarly to the sample of Example 1-1, for the sample of ReferenceExample 1, the voltage dependence of the E.Q.E. was measured. FIG. 33illustrates the voltage dependence of E.Q.E. in the sample of ReferenceExample 1.

As illustrated in FIG. 33, similarly to the sample of Example 1-1, inthe sample of Reference Example 1, due to the increase in the absolutevalue of the bias voltage applied to the lower-surface electrode, theE.Q.E. at near (near 870 nm) the absorption peak position of SnNcincluded in the lower-side photoelectric conversion layer increases.From FIG. 33, even with the configuration in which the mixed layerincluding both the first material and the second material is disposedbetween the photoelectric conversion layers in the multilayer structurehaving the first and second photoelectric conversion layers, the effectof sensitivity modulation can be obtained by switching the bias voltage.

Example 1-2

Similarly to the sample of Example 1-1, a sample of Example 1-2 wasproduced except that CIAIPc and C₇₀ were used as the material to formthe lower-side photoelectric conversion layer. In the formation of thelower-side photoelectric conversion layer, the conditions for vapordeposition were adjusted so that the volume ratio between CIAIPc and C₇₀becomes 1:9. Table 3 below lists the material and the thickness of eachlayer in the sample of Example 1-2.

TABLE 3 THICKNESS LAYER MATERIAL (nm) UPPER-SURFACE ELECTRODE Al 80UPPER-SIDE PHOTOELECTRIC DTDCTB:C₇₀ (1:9) 60 CONVERSION LAYER LOWER-SIDECIAIPc:C₇₀ (1:1) 60 PHOTOELECTRIC CONVERSION LAYER ELECTRON BLOCKINGLAYER CZBDF 10 LOWER-SURFACE ITO 150 ELECTRODE

Comparative Example 1

Similarly to the sample of Example 1-2, a sample of Comparative Example1 was produced except that the conditions for vapor deposition wereadjusted so that the volume ratio between CIAIPc and C₇₀, and the volumeratio between DTDCTB and C₇₀ become 1:4. Table 4 below lists thematerial and the thickness of each layer in the sample of ComparativeExample 1.

TABLE 4 THICKNESS LAYER MATERIAL (nm) UPPER-SURFACE ELECTRODE Al 80UPPER-SIDE PHOTOELECTRIC DTDCTB:C₇₀ (1:4) 60 CONVERSION LAYER LOWER-SIDECIAIPc:C₇₀ (1:4) 60 PHOTOELECTRIC CONVERSION LAYER ELECTRON BLOCKINGLAYER CZBDF 10 LOWER-SURFACE ITO 150 ELECTRODE

Similarly to the sample of Example 1-1, for the samples of Example 1-2and Comparative Example 1, the voltage dependence of the E.Q.E. wasmeasured. FIGS. 34 and 35 illustrate the voltage dependence of theE.Q.E. in the samples of Example 1-2 and Comparative Example 1,respectively.

As illustrated in FIG. 34, in the sample of Example 1-2, the E.Q.E. inthe infrared range increases as the electric field strength appliedacross two electrodes increases. That is, in the sample of Example 1-2,due to the increase in the absolute value of the bias voltage applied tothe lower-surface electrode, the E.Q.E. at near (near 750 nm) theabsorption peak position of CIAIPc included in the lower-sidephotoelectric conversion layer increases. In other words, modulation ofsensitivity occurred in the infrared range by switching the biasvoltage. For instance, at the wavelength corresponding to the absorptionpeak of CIAIPc, the E.Q.E. when the potential of the lower-surfaceelectrode was set to −1 V is compared with the E.Q.E. when the potentialof the lower-surface electrode was set to −5 V, the latter wasapproximately 6.55 times the former. In contrast, as illustrated in FIG.35, in the sample of Comparative Example 1, even when the bias voltageapplied to the lower-surface electrode is changed, no significant changewas observed in the graph of E.Q.E., and it is found that no modulationof sensitivity occurred in the infrared range by switching the biasvoltage.

Next, similarly to the sample of Example 1-1, for each of the samples ofExample 1-2 and the sample of Comparative Example 1, a sample havingonly the upper-side photoelectric conversion layer between thelower-surface electrode and the upper-surface electrode, and a samplehaving only the lower-side photoelectric conversion layer between thelower-surface electrode and the upper-surface electrode were produced,and the impedance of the upper-side photoelectric conversion layer andthe impedance of the lower-side photoelectric conversion layer weremeasured. The thicknesses of the upper-side photoelectric conversionlayer and the lower-side photoelectric conversion layer in the sample ofa measurement target are both 200 nm. Table 5 below lists the result ofmeasurement of impedance. Each of the values of impedance listed belowis a value when the bias voltage to the lower-surface electrode withrespect to the upper-surface electrode at −8 V and the frequency at 1Hz.

TABLE 5 DONOR- ACCEPTOR IMPEDANCE SAMPLE LAYER RATIO (Ω) EXAMPLE 1-2UPPER-SIDE DTDCTB:C₇₀ 1.2 × 10⁷ PHOTOELECTRIC (1:9) CONVERSION LAYERLOWER-SIDE CIAIPc:C₇₀ 6.3 × 10⁴ PHOTOELECTRIC (1:1) CONVERSION LAYERCOMPARATIVE UPPER-SIDE DTDCTB:C₇₀ 3.0 × 10⁷ EXAMPLE 1 PHOTOELECTRIC(1:4) CONVERSION LAYER LOWER-SIDE CIAIPc:C₇₀ 1.0 × 10⁷ PHOTOELECTRIC(1:4) CONVERSION LAYER

As seen from Table 5, in the sample of Comparative Example 1, theimpedance of the upper-side photoelectric conversion layer wasapproximately three times greater than the impedance of the lower-sidephotoelectric conversion layer, whereas in the sample of Example 1-2,the impedance of the upper-side photoelectric conversion layer wasapproximately 190 times greater than the impedance of the lower-sidephotoelectric conversion layer. Modulation of sensitivity by switchingthe bias voltage was not observed in the sample of Comparative Example1, whereas modulation of sensitivity by switching the bias voltage wasobserved in the sample of Example 1-2. This is probably because theimpedance difference between the upper-side photoelectric conversionlayer and the lower-side photoelectric conversion layers has increased.

It is to be noted that in the samples of Example 1-1 and Example 1-2,the ionization potential of DTDCTB used for formation of the upper-sidephotoelectric conversion layer is approximately 5.6 eV. The ionizationpotential of SnNc used for formation of the lower-side photoelectricconversion layer in the sample of Example 1-1 and the ionizationpotential of CIAIPc used for formation of the lower-side photoelectricconversion layer in the sample of Example 1-2 are 5.0 eV and 5.5 eV,respectively. Therefore, in the samples of Example 1-1 and Example 1-2,no potential barrier for the positive charges is formed between thelower-side photoelectric conversion layer and the upper-sidephotoelectric conversion layers. Thus, when the impedance differencebetween two photoelectric conversion layers in the multilayer structureis high to some extent, modulation of sensitivity by switching the biasvoltage is obtained even when no potential barrier for the positivecharges is present.

Example 2-1

Similarly to the sample of Example 1-1 essentially, a sample of Example2-1 was produced except that SnNc and C₇₀ were used as the material toform the upper-side photoelectric conversion layer, and rubrene and C₇₀were used as the material to form the lower-side photoelectricconversion layer. The volume ratio between SnNc and C₇₀, and the volumeratio between rubrene and C₇₀ were adjusted to be 1:4. Table 6 belowlists the material and the thickness of each layer in the sample ofExample 2-1. As illustrated in Table 6, both the thickness of theupper-side photoelectric conversion layer and the lower-sidephotoelectric conversion layer were 200 nm.

TABLE 6 THICKNESS LAYER MATERIAL (nm) UPPER-SURFACE ELECTRODE Al 80UPPER-SIDE PHOTOELECTRIC SnNc:C₇₀ (1:4) 200 CONVERSION LAYER LOWER-SIDEPHOTOELECTRIC Rubrene:C₇₀ (1:4) 200 CONVERSION LAYER ELECTRON BLOCKINGLAYER CZBDF 10 LOWER-SURFACE ELECTRODE ITO 150

Comparative Example 2-1

Similarly to the sample of Example 2-1, a sample of Comparative Example2-1 was produced except that Rubrene and C₇₀ were used as the materialto form the upper-side photoelectric conversion layer, and SnNc and C₇₀were used as the material to form the lower-side photoelectricconversion layer. In other words, the sample of Comparative Example 2-1has a configuration in which the upper-side photoelectric conversionlayer and the lower-side photoelectric conversion layer in the sample ofExample 2-1 are swapped. Table 7 below lists the material and thethickness of each layer in the sample of Comparative Example 2-1.

TABLE 7 THICKNESS LAYER MATERIAL (nm) UPPER-SURFACE ELECTRODE Al 80UPPER-SIDE PHOTOELECTRIC Rubrene:C₇₀ (1:4) 200 CONVERSION LAYERLOWER-SIDE PHOTOELECTRIC SnNc:C₇₀ (1:4) 200 CONVERSION LAYER ELECTRONBLOCKING LAYER CZBDF 10 LOWER-SURFACE ELECTRODE ITO 150

Similarly to the sample of Example 1-1, for the samples of Example 2-1and Comparative Example 2-1, the voltage dependence of the E.Q.E. wasmeasured. FIGS. 36 and 37 illustrate the voltage dependence of theE.Q.E. in the samples of Example 2-1 and Comparative Example 2-1,respectively.

In FIG. 36, as illustrated by a dashed ellipse S, in the sample ofExample 2-1, the E.Q.E. in the infrared range increases as the electricfield strength applied across two electrodes increases. In thisinstance, sufficient sensitivity has occurred in the infrared range atnear a point where the bias voltage applied to the lower-surfaceelectrode falls below −5V. In other words, in the sample of Example 2-1,due to the increase in the absolute value of the bias voltage applied tothe lower-surface electrode, the E.Q.E. at near the absorption peakposition of SnNc included in the lower-side photoelectric conversionlayer increases. For instance, at the wavelength (near 870 nm)corresponding to the absorption peak of SnNc, the E.Q.E. when thepotential of the lower-surface electrode was set to −3 V is comparedwith the E.Q.E. when the potential of the lower-surface electrode wasset to −10 V, the latter was approximately 4.27 times the former.

In contrast, as illustrated in FIG. 37, in the sample of ComparativeExample 2-1, both the E.Q.E. in the infrared range and the E.Q.E. in thevisible range increase as the electric field strength applied across twoelectrodes increases. That is, in the sample of Comparative Example 2-1,no distinct modulation of sensitivity occurred in the infrared range byswitching the bias voltage.

Next, similarly to the sample of Example 1-1, for each of the samples ofExample 2-1 and the sample of Comparative Example 2-1, a sample havingonly the upper-side photoelectric conversion layer between thelower-surface electrode and the upper-surface electrode, and a samplehaving only the lower-side photoelectric conversion layer between thelower-surface electrode and the upper-surface electrode were produced,and the impedance of the upper-side photoelectric conversion layer andthe impedance of the lower-side photoelectric conversion layer weremeasured. The thicknesses of the upper-side photoelectric conversionlayer and the lower-side photoelectric conversion layer in the sample ofa measurement target are both 200 nm. Table 8 below lists the result ofmeasurement of impedance.

TABLE 8 DONOR- ACCEPTOR IMPEDANCE SAMPLE LAYER RATIO (Ω) EXAMPLE 2-1UPPER-SIDE SnNc:C₇₀ 1.0 × 10⁴ PHOTOELECTRIC (1:4) CONVERSION LAYERLOWER-SIDE Rubrene:C₇₀ 9.0 × 10³ PHOTOELECTRIC (1:4) CONVERSION LAYERCOMPARATIVE UPPER-SIDE Rubrene:C₇₀ 9.0 × 10³ EXAMPLE 2-1 PHOTOELECTRIC(1:4) CONVERSION LAYER LOWER-SIDE SnNc:C₇₀ 1.0 × 10⁴ PHOTOELECTRIC (1:4)CONVERSION LAYER

As seen in Table 8, in the sample of Comparative Example 2-1, theimpedance of the upper-side photoelectric conversion layer is lower thanthe impedance of the lower-side photoelectric conversion layer. Incontrast, in the sample of Example 2-1, the impedance of the upper-sidephotoelectric conversion layer is greater than the impedance of thelower-side photoelectric conversion layer. However, the ratio of theimpedance of the upper-side photoelectric conversion layer to thelower-side photoelectric conversion layer is approximately 1.1 times,and a large difference was observed between the lower-side photoelectricconversion layer and the upper-side photoelectric conversion layer.

Here, when attention is focused on the ionization potentials of rubreneand SnNc, the ionization potential of rubrene is 5.35 eV and theionization potential of SnNc is 5.0 eV. Therefore, in the sample ofExample 2-1, for the positive charges that move toward the lower-surfaceelectrode, a potential barrier of 0.35 eV is present between the HOMOlevel of rubrene and the HOMO level of SnNc (see FIG. 28). In contrast,in the sample of Comparative Example 2-1, for the positive charges thatmove toward the lower-surface electrode, no potential barrier is presentbetween the HOMO level of rubrene and the HOMO level of SnNc. It ispresumed that the reason why no distinct modulation of sensitivity inthe infrared range was observed in the sample of Comparative Example2-1, and yet distinct modulation of sensitivity in the infrared rangewas observed in the sample of Example 2-1 is that a potential barrierfor the positive holes was formed between two photoelectric conversionlayers.

Example 2-2

The materials listed in Table 9 below were deposited sequentially on aglass substrate by vacuum deposition, and thus a sample of Example 2-2was produced. In the formation of the lower-side photoelectricconversion layer, CIAIPc and Coo were co-evaporated, and in theformation of the upper-side photoelectric conversion layer, α-6T and C₇₀were co-evaporated. In the formation of the lower-side photoelectricconversion layer, the conditions for vapor deposition were adjusted sothat the volume ratio between CIAIPc and C₆₀ becomes 1:4, and in theformation of the upper-side photoelectric conversion layer, theconditions for vapor deposition were adjusted so that the volume ratiobetween α-6T and C₇₀ becomes 1:1.

TABLE 9 THICKNESS LAYER MATERIAL (nm) UPPER-SURFACE ELECTRODE Al 80UPPER-SIDE PHOTOELECTRIC α-6T:C₇₀ (1:1) 60 CONVERSION LAYER LOWER-SIDEPHOTOELECTRIC CIAIPc:C₆₀ (1:4) 60 CONVERSION LAYER ELECTRON BLOCKINGLAYER CZBDF 10 LOWER-SURFACE ELECTRODE ITO 150

FIG. 38 illustrates an energy diagram for the sample of Example 2-2. Asillustrated in FIG. 38, the ionization potentials of CIAIPc and α-6T are5.5 eV and 5.3 eV, respectively, and in the sample of Example 2-2, apotential barrier of 0.2 eV is formed between the HOMO level of CIAIPcand the HOMO level of α-6T.

Similarly to the sample of Example 1-1, for the sample of Example 2-2,the voltage dependence of the E.Q.E. was measured. FIG. 39 illustratesthe voltage dependence of the E.Q.E. in the sample of Example 2-2. Asillustrated in FIG. 39, in the sample of Example 2-2, due to theincrease in the absolute value of the bias voltage applied to thelower-surface electrode, the E.Q.E. at near (near 440 nm) the absorptionpeak position of α-6T increases. In other words, the E.Q.E. in thevisible range increases. That is, in this instance, the effect ofmodulation of sensitivity by switching the bias voltage in the visiblerange is obtained.

Comparative Example 2-2

Similarly to the sample of Example 2-2, a sample of Comparative Example2-2 was produced except that the material to form the upper-sidephotoelectric conversion layer and the material to form the lower-sidephotoelectric conversion layer are swapped. Table 10 below lists thematerial and the thickness of each layer in the sample of Example 2-2.

TABLE 10 THICKNESS LAYER MATERIAL (nm) UPPER-SURFACE ELECTRODE Al 80UPPER-SIDE PHOTOELECTRIC CIAIPc:C₆₀ (1:4) 60 CONVERSION LAYER LOWER-SIDEPHOTOELECTRIC α-6T:C₇₀ (1:1) 60 CONVERSION LAYER ELECTRON BLOCKING LAYERCZBDF 10 LOWER-SURFACE ELECTRODE ITO 150

FIG. 40 illustrates an energy diagram for the sample of ComparativeExample 2-2. As seen from FIG. 40, in this instance, no potentialbarrier for the positive charges is formed between the HOMO level ofCIAIPc and the HOMO level of α-6T.

Similarly to the sample of Example 1-1, for the sample of ComparativeExample 2-2, the voltage dependence of the E.Q.E. was measured. FIG. 41illustrates the voltage dependence of E.Q.E. in a sample of ComparativeExample 2-2. As illustrated in FIG. 41, in the sample of ComparativeExample 2-2, even when the bias voltage applied to the lower-surfaceelectrode is changed, no significant change was observed in the graph ofE.Q.E., and no modulation of sensitivity occurred by switching the biasvoltage.

It is found from FIGS. 36 to 41 that sensitivity modulation can beachieved through switching the bias voltage by forming a potentialbarrier for the positive charges between the HOMO level of the materialof which the upper-side photoelectric conversion layer is composed andthe HOMO level of the material of which the lower-side photoelectricconversion layer is composed. From comparison between Example 2-2 andComparative Example 2-2, distinct increase in the E.Q.E. can be achievedeven in the visible range by appropriately selecting materials for thetwo photoelectric conversion layers in the multilayer structure.

It is found from comparison between Example 2-2 and Comparative Example2-2 that when the material for one photoelectric conversion layer has anionization potential greater than the ionization potential of thematerial for the other photoelectric conversion layer by 0.2 eV or more,the effect of distinct increase in the E.Q.E. can be achieved in aspecific wavelength range in addition to the infrared range, the onephotoelectric conversion layer being one of two photoelectric conversionlayers included in the multilayer structure in the photoelectricconversion structure and being closer to an electrode relatively low inpotential (the lower-surface electrode in this instance). For instance,the ionization potential of Si(OSiR₃)₂Nc and the ionization potential ofCuPc are 5.4 eV and 5.2 eV, respectively, and thus when Si(OSiR₃)₂Nc andCuPc are used as the first material and the second material,respectively, it is expected that distinct modulation of sensitivity inthe visible range occurs. Instead of rubrene of Example 2-2, CuPc may beused.

(Typical Example of Photoelectric Current Characteristics inPhotoelectric Conversion Layer)

Furthermore, a photoelectric conversion structure that exhibitsphotocurrent characteristics as described below is used for thephotoelectric converter PC, and the potential difference Φ between thepixel electrode 61 and the opposite electrode 62 is reduced to someextent, thereby making it possible to suppress movement of signalcharges already accumulated in the charge accumulation region to theopposite electrode 62 via the photoelectric conversion structure 64, andfurther accumulation of the signal charges in the charge accumulationregion after the potential difference is reduced. Consequently, thefunction of a shutter can be electrically achieved by controlling themagnitude of the bias voltage to be applied to the photoelectricconversion structure. Therefore, for instance, a global shutter functioncan be achieved without separately providing a device such as a transfertransistor in each of the multiple imaging cells.

FIG. 42 illustrates a typical photocurrent characteristic of aphotoelectric conversion structure according to Embodiments of thepresent disclosure. The thick solid graph in FIG. 42 illustrates anexemplary I-V characteristics of the photoelectric conversion structureunder irradiation with light. It is to be noted that FIG. 42 alsoillustrates an instance of I-V characteristics under no irradiation withlight by a thick dashed line.

FIG. 42 illustrates the change in the current density between the majorsurfaces of the photoelectric conversion structure (the photoelectricconversion structure 64, 64A, or 64B) when the bias voltage to beapplied across the two major surfaces is changed under certainillumination. In the present description, the forward direction and thereverse direction in the bias voltage are defined as follows: When thephotoelectric conversion structure has a structure of junction between alayered p-type semiconductor and a layered n-type semiconductor, a biasvoltage that causes the potential of a layer of p-type semiconductor tobe higher than the potential of a layer of n-type semiconductor isdefined as the bias voltage in the forward direction. On the other hand,a bias voltage that causes the potential of a layer of p-typesemiconductor to be lower than the potential of a layer of n-typesemiconductor is defined as the bias voltage in the reverse direction.Similarly to the case where an inorganic semiconductor material is used,in the case where an organic semiconductor material is used, the forwarddirection and the reverse direction can be defined. When thephotoelectric conversion structure has a bulk heterojunction structure,as schematically illustrated in FIG. 1 in Japanese Patent No. 5553727mentioned above, a p-type semiconductor appears more often than ann-type semiconductor on one of the two major surfaces of a bulkheterojunction structure, which face respective electrodes, and ann-type semiconductor appears more often than a p-type semiconductor onthe other major surface. Therefore, a bias voltage that causes thepotential of one major surface in which a p-type semiconductor appearsmore often than an n-type semiconductor to be higher than the potentialof the other major surface in which an n-type semiconductor appears moreoften than a p-type semiconductor can be defined as the bias voltage inthe forward direction.

As illustrated in FIG. 42, for instance, the photoelectric currentcharacteristics of the photoelectric conversion structure 64 isschematically characterized by first to third voltage ranges. The firstvoltage range is a reverse bias voltage range in which the absolutevalue of output current density increases as a reverse direction biasvoltage increases. The first voltage range may be a voltage range suchthat a photoelectric current increases as the bias voltage appliedacross the major surfaces of the photoelectric conversion structureincreases. The second voltage range is a forward bias voltage range inwhich the absolute value of output current density increases as aforward direction bias voltage increases. In other words, the secondvoltage range may be a voltage range such that a forward directioncurrent increases as the bias voltage applied across the major surfacesof the photoelectric conversion structure increases. The third voltagerange is a voltage range between the first voltage range and the secondvoltage range.

The first to third voltage ranges can be distinguished by the slope of agraph of photoelectric current characteristics when linear vertical axisand horizontal axis are used. For reference, in FIG. 42, an averageslope of the graph in each of the first voltage range and the secondvoltage range is indicated by a dashed line L1 and a dashed line L2,respectively. As illustrated in FIG. 42, a rate of change in the outputcurrent density for an increase in the bias voltage in the first voltagerange, the second voltage range, and the third voltage range isdifferent from range to range. The third voltage range is defined as thevoltage range in which the rate of change in the output current densityfor the bias voltage is lower than the rate of change in the firstvoltage range and the rate of change in the second voltage range.Alternatively, the third voltage range may be determined based on arising or falling position in the graph illustrating the I-Vcharacteristics. The third voltage range is typically a voltage rangegreater than −1 V and smaller than 1 V. In the third voltage range, evenwhen the bias voltage is changed, the current density between the majorsurfaces of the photoelectric conversion structure hardly changes. Asillustrated in FIG. 42, in the third voltage range, the absolute valueof current density is typically 100 μA/cm² or less.

For instance, the potential of the pixel electrode 61 is adjusted byswitching the voltage applied to the first signal line 31 from thevoltage supply circuit 41, and thereby the potential difference betweenthe pixel electrode 61 and the opposite electrode 62, in other words,the bias voltage applied across the major surfaces of the photoelectricconversion structure at the start of a signal accumulation period can bewithin the third voltage range. A state can be achieved in whichsubstantially no charges are moved between the photoelectric conversionstructure and the electrodes, by maintaining the bias voltage appliedacross the major surfaces of the photoelectric conversion structurewithin the third voltage range. In short, an electrical shutter can beachieved.

The imaging device in the present disclosure is applicable to an imagesensor, for instance. The imaging device in the present disclosure canbe used for a digital camera, a camera for medical use, and a camera forrobots. Acquisition of an image utilizing the infrared light is alsopossible by appropriately selecting the material for the photoelectricconversion structure, and the voltage applied to the first signal line.Embodiments of the present disclosure are also useful for a securitycamera, and a camera mounted and used in a vehicle.

What is claimed is:
 1. An imaging device comprising: an imaging cell including a photoelectric converter including a first electrode, a second electrode, and a photoelectric conversion layer between the first electrode and the second electrode, a first transistor one of a source and a drain of which is coupled to the first electrode, and a second transistor having a gate coupled to the first electrode; first voltage supply circuitry coupled to the other of the source and the drain of the first transistor, the first voltage supply circuitry being configured to supply a first voltage in a first period and a second voltage different from the first voltage in a second period different from the first period, and second voltage supply circuitry different from the first voltage supply circuitry, second voltage supply circuitry being coupled to one of a source and a drain of the second transistor and being configured to supply a third voltage.
 2. The imaging device according to claim 1, further comprising: an inverting amplifier having a inverting input terminal, a non-inverting input terminal, and an output terminal, wherein the other of the source and the drain of the second transistor is coupled to the inverting input terminal, the other of the source and the drain of the first transistor is coupled to the first output terminal, and the first voltage supply circuitry is coupled to the non-inverting input terminal.
 3. An imaging device comprising: an imaging cell including a photoelectric converter including a first electrode, a second electrode, and a photoelectric conversion layer between the first electrode and the second electrode, and a first transistor one of a source and a drain of which is coupled to the first electrode; voltage supply circuitry coupled to the other of the source and the drain of the first transistor, the voltage supply circuitry being configured to supply a first voltage in a first period and a second voltage different from the first voltage in a second period different from the first period; and selection circuitry coupled to a first control line and a second control line, the selection circuitry switching between ON and OFF of the first transistor based on a voltage of the first control line and a voltage of the second control line.
 4. An imaging device comprising: an imaging cell including a photoelectric converter including a first electrode, a second electrode, and a photoelectric conversion layer between the first electrode and the second electrode, and a first transistor one of a source and a drain of which is coupled to the first electrode; and voltage supply circuitry coupled to the other of the source and the drain of the first transistor, the voltage supply circuitry being configured to supply a first voltage in a first period and a second voltage different from the first voltage in a second period different from the first period, wherein the voltage supply circuitry supplies the first voltage to the other of the source and the drain of the first transistor in a reset period in a first frame period, and supplies the second voltage to the other of the source and the drain of the first transistor in a reset period in a second frame period different from the first frame period.
 5. The imaging device according to claim 2, wherein the first voltage supply circuitry supplies the first voltage to the non-inverting input terminal in a reset period in a first frame period, and supplies the second voltage to the non-inverting input terminal in a reset period in a second frame period different from the first frame period.
 6. The imaging device according to claim 1, wherein the photoelectric conversion layer includes a first layer and a second layer, and impedance of the first layer is greater than impedance of the second layer.
 7. The imaging device according to claim 1, wherein the photoelectric conversion layer includes a first layer and a second layer, the first layer includes a first material, the second layer includes a second material, and an ionization potential of the first material is greater than an ionization potential of the second material by 0.2 eV or more.
 8. The imaging device according to claim 6, wherein the first layer includes a first material, the second layer includes a second material, and the first material and the second material are both electron-donating molecules.
 9. The imaging device according to claim 7, wherein the first material and the second material are both electron-donating molecules.
 10. The imaging device according to claim 1, wherein each of the first voltage and the second voltage is different from the third voltage.
 11. The imaging device according to claim 1, wherein the first voltage supply circuitry is coupled to the other of the source and the drain of the first transistor not through the second transistor. 